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SN74HCU04ANSRG4 is listed in the Inverter Gates range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC INVERTER 6CH 1-INP 14SO. Review the specifications below when checking this part for your BOM.
The SN74HCU04ANSRG4 is a hex inverter integrated circuit manufactured by Texas Instruments. It belongs to the SNx4HCU04 series, utilizing high-speed CMOS technology with ultra-low power consumption. The device features six independent inverters within a single package. It operates over a wide supply voltage range of 2 V to 6 V and supports a maximum propagation delay of 14 ns at 6 V with a 50 pF load. The component is housed in a 14-pin TSSOP surface-mount package and is rated for operation from -40°C to +85°C.
Verify the specific suffix 'SRG4' against official Texas Instruments documentation to confirm the exact tape-and-reel packaging configuration and RoHS compliance status. Ensure the ordering part number matches the required pinout and thermal characteristics for your PCB layout. Cross-reference the manufacturer's latest datasheet to confirm current production status and any recent design changes or obsolescence notices.
Select this component when a balance of high switching speed and minimal power consumption is required for battery-operated or energy-efficient designs. The wide voltage range allows compatibility with various logic families. Consider the TSSOP-14 package dimensions for space-constrained applications. Verify that the input voltage levels are compatible with the driving source across the entire operating temperature range.
This component is part of the SNx4HCU04 family of hex inverters from Texas Instruments. The HCU designation indicates High-speed CMOS with Ultra-low Power characteristics. This series is designed to replace older standard CMOS logic while offering improved performance metrics. It serves as a fundamental building block for complex digital circuits requiring signal inversion.
Compatible substitutes include SN74HCU04DR and SN74HCU04D. Verify pin compatibility and electrical specifications before substitution. Ensure the alternative package type matches the existing footprint or allows for reflow soldering adjustments.
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