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STM32WB55REV6 is listed in the RF Transceiver ICS range at ChipApex. The manufacturer field lists STMicroelectronics. Its product description is IC RF TXRX+MCU 802.15.4 68VFQFPN. Review the specifications below when checking this part for your BOM.
The STM32WB55REV6 is a multiprotocol wireless microcontroller featuring an ultra-low-power dual-core architecture with a 64 MHz Arm Cortex-M4 and a 32 MHz Cortex-M0+. It integrates a Bluetooth Low Power radio supporting v5.3, Thread, and Zigbee protocols in the 2.405GHz to 2.48GHz range. The device includes 512kB of Flash memory and 256kB of SRAM. Key electrical parameters include a maximum output power of 6dBm, sensitivity of -100dBm, and a data rate up to 2Mbps. It operates on a supply voltage of 1.71V to 3.6V, with receive currents ranging from 4.5mA to 7.9mA and transmit currents from 5.2mA to 12.7mA. The component is housed in a 68-VFQFN package.
Verify the specific ordering suffix to confirm the exact package variant and temperature grade, as revisions may affect mechanical dimensions or thermal performance. Ensure compatibility with the intended PCB footprint for the 68-VFQFN package. Cross-reference the latest errata sheet for any known silicon revisions that might impact specific peripheral behaviors or radio characteristics before finalizing procurement.
Select this component when both high computational throughput and strict power constraints are required simultaneously. The dual-core design allows the M0+ to handle real-time radio stacks while the M4 manages application logic. Consider the 512kB Flash capacity for complex firmware requirements. Evaluate the 68-pin package density against available board space, noting the exposed pad requirement for thermal management and grounding.
This part belongs to the STM32WB55xx series, designed for IoT applications needing robust wireless connectivity. It shares architectural similarities with other WB55 variants but differs in memory size and package configuration. The REV6 designation indicates a specific manufacturing revision within the active product line, ensuring availability and long-term supply support for embedded system designs.
Direct substitutes within the same family include STM32WB55CCU6 for different packaging needs or STM32WB55RGV6 for increased Flash capacity. Verify pin-to-pin compatibility and software library support when transitioning between these variants to ensure seamless integration without significant hardware redesign.
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