Instrumentation, Op Amps, Buffer Amps TLC27M4IDRG4 product image

TLC27M4IDRG4

$0.49
  • Description:IC OPAMP GP 4 CIRCUIT 14SOIC
  • Series:LinCMOS™
  • Mfr:Texas Instruments
  • Package:Tape & Reel (TR)

SKU:f2664a3bb109 Category: Brand:

  
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TLC27M4IDRG4 is listed in the Instrumentation, Op Amps, Buffer Amps range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC OPAMP GP 4 CIRCUIT 14SOIC. Review the specifications below when checking this part for your BOM.

Instrumentation, Op Amps, Buffer Amps specifications for TLC27M4IDRG4

  • Description:IC OPAMP GP 4 CIRCUIT 14SOIC
  • Series:LinCMOS™
  • Mfr:Texas Instruments
  • Package:Tape & Reel (TR)
  • Amplifier Type:General Purpose
  • Number of Circuits:4
  • Output Type:-
  • Slew Rate:0.62V/µs
  • Gain Bandwidth Product:525 kHz
  • Current - Input Bias:0.7 pA
  • Voltage - Input Offset:1.1 mV
  • Current - Supply:570µA (x4 Channels)
  • Current - Output / Channel:30 mA
  • Voltage - Supply Span (Min):4 V
  • Voltage - Supply Span (Max):16 V
  • Operating Temperature:-40°C ~ 85°C
  • Grade:-
  • Qualification:-
  • Mounting Type:Surface Mount
  • Package / Case:14-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package:14-SOIC
  • -3db Bandwidth:-

Instrumentation, Op Amps, Buffer Amps datasheet and documents for TLC27M4IDRG4

TLC27M4IDRG4

Instrumentation, Op Amps, Buffer Amps Overview

The TLC27M4IDRG4 is a quad precision operational amplifier from Texas Instruments, utilizing LinCMOS technology. It features four independent channels in a 14-SOIC surface-mount package. Key electrical parameters include a gain-bandwidth product of 525 kHz and a slew rate of 620 mV/µs. The device operates on a single supply voltage ranging from 3 V to 16 V, with a typical quiescent current of 570 µA for all four channels. It offers an input bias current of 700 fA and an output drive capability of 30 mA per channel.

Instrumentation, Op Amps, Buffer Amps Feature Summary

  • Integrates four precision operational amplifiers within a single compact package.
  • Utilizes LinCMOS technology to achieve low power consumption while maintaining precision performance.
  • Provides rail-to-rail output swing capabilities for maximum dynamic range.
  • Features high input impedance with extremely low input bias current.

Instrumentation, Op Amps, Buffer Amps Applications

  • Battery-powered instrumentation systems requiring low quiescent current.
  • Signal conditioning circuits for sensors with high-impedance outputs.
  • Portable medical devices and handheld measurement tools.
  • Data acquisition systems with multiple analog input channels.

Instrumentation, Op Amps, Buffer Amps Procurement Notes

Verify the complete part number including the suffix 'G4' to confirm lead-free and RoHS compliance status as specified by Texas Instruments. Ensure the SOIC-14 package width matches your PCB footprint design constraints. Confirm that the industrial temperature range specifications meet your application's environmental requirements before finalizing procurement orders.

Instrumentation, Op Amps, Buffer Amps Selection Notes

Select this component when multiple precision amplification stages are needed in space-constrained designs. The LinCMOS process offers a balance between low power dissipation and sufficient bandwidth for general-purpose applications. Consider the 30 mA output current capability if driving moderate loads directly without additional buffering stages.

Instrumentation, Op Amps, Buffer Amps Part Context

This device belongs to the TLC27M4 family of precision quad operational amplifiers. It shares architectural similarities with other LinCMOS products like the TLC27L4 series but offers specific performance characteristics tailored for general-purpose precision applications. The IDRG4 suffix indicates an industrial temperature range and tape-and-reel packaging format suitable for automated assembly processes.

Instrumentation, Op Amps, Buffer Amps Replacement Considerations

TLC27M4BCDR is a verified alternative offering identical electrical specifications in a tube package format rather than reel packaging. Designers should verify pin compatibility and thermal performance characteristics when substituting between different packaging types within the same functional family.

TLC27M4IDRG4TLC27M4IDRG4
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