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TLC27M4IDRG4 is listed in the Instrumentation, Op Amps, Buffer Amps range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC OPAMP GP 4 CIRCUIT 14SOIC. Review the specifications below when checking this part for your BOM.
The TLC27M4IDRG4 is a quad precision operational amplifier from Texas Instruments, utilizing LinCMOS technology. It features four independent channels in a 14-SOIC surface-mount package. Key electrical parameters include a gain-bandwidth product of 525 kHz and a slew rate of 620 mV/µs. The device operates on a single supply voltage ranging from 3 V to 16 V, with a typical quiescent current of 570 µA for all four channels. It offers an input bias current of 700 fA and an output drive capability of 30 mA per channel.
Verify the complete part number including the suffix 'G4' to confirm lead-free and RoHS compliance status as specified by Texas Instruments. Ensure the SOIC-14 package width matches your PCB footprint design constraints. Confirm that the industrial temperature range specifications meet your application's environmental requirements before finalizing procurement orders.
Select this component when multiple precision amplification stages are needed in space-constrained designs. The LinCMOS process offers a balance between low power dissipation and sufficient bandwidth for general-purpose applications. Consider the 30 mA output current capability if driving moderate loads directly without additional buffering stages.
This device belongs to the TLC27M4 family of precision quad operational amplifiers. It shares architectural similarities with other LinCMOS products like the TLC27L4 series but offers specific performance characteristics tailored for general-purpose precision applications. The IDRG4 suffix indicates an industrial temperature range and tape-and-reel packaging format suitable for automated assembly processes.
TLC27M4BCDR is a verified alternative offering identical electrical specifications in a tube package format rather than reel packaging. Designers should verify pin compatibility and thermal performance characteristics when substituting between different packaging types within the same functional family.
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