Digital Signal Processor Dsp TMS320VC5501GZZ300 product image

TMS320VC5501GZZ300

  • Description:IC FXD-PNT DSP 600 MIPS 201-BGA
  • Series:TMS320C55x

SKU:3d243101e193 Category: Brand:

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TMS320VC5501GZZ300 is listed in the Digital Signal Processor Dsp range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC FXD-PNT DSP 600 MIPS 201-BGA. Review the specifications below when checking this part for your BOM.

Digital Signal Processor Dsp specifications for TMS320VC5501GZZ300

  • Description:IC FXD-PNT DSP 600 MIPS 201-BGA
  • Series:TMS320C55x
  • Mfr:Texas Instruments
  • Package:Tube
  • Type:Fixed Point
  • Interface:Host Interface, I2C, McBSP, UART
  • Clock Rate:300MHz
  • Non-Volatile Memory:ROM (32kB)
  • On-Chip RAM:48kB
  • Voltage - I/O:3.30V
  • Voltage - Core:1.26V
  • Operating Temperature:-40°C ~ 85°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:201-LFBGA
  • Supplier Device Package:201-BGA MICROSTAR (15x15)
  • Grade:-
  • Qualification:-

Digital Signal Processor Dsp datasheet and documents for TMS320VC5501GZZ300

TMS320VC5501GZZ300

Digital Signal Processor Dsp Overview

The TMS320VC5501GZZ300 is a fixed-point digital signal processor from the Texas Instruments TMS320VC5501 series. It features a C55x DSP core operating at a maximum clock frequency of 300 MHz, delivering up to 600 MIPS performance. The device integrates 32 kB of data RAM and 32 kB of program memory (DARAM/ROM). It utilizes a BGA Microstar package with 201 pins and supports standard surface-mount installation. The component operates within an industrial temperature range of -40°C to +85°C.

Digital Signal Processor Dsp Feature Summary

  • C55x DSP core with 300 MHz maximum frequency
  • Integrated 32 kB DARAM and 32 kB ROM
  • 201-pin BGA Microstar package
  • -40°C to +85°C operating temperature range

Digital Signal Processor Dsp Applications

  • Low-power audio processing systems
  • Portable consumer electronics
  • Industrial control applications

Digital Signal Processor Dsp Procurement Notes

Verify the specific suffix 'GZZ' against official Texas Instruments documentation to confirm pinout and electrical characteristics for the BGA Microstar package. Ensure compatibility with existing PCB footprints designed for 201-pin BGA components. Confirm moisture sensitivity levels and reflow soldering profiles prior to assembly.

Digital Signal Processor Dsp Selection Notes

Select this model when a 300 MHz fixed-point DSP is required in a compact BGA form factor. Compare against the PGF300 variant if LQFP-176 packaging is preferred for prototyping or manual assembly. Verify that the 32 kB internal memory meets system requirements before considering external memory interfaces.

Digital Signal Processor Dsp Part Context

This part belongs to the TMS320VC5501 family, which shares the same C55x core architecture as the VC5502. The primary distinction lies in the package type; the GZZ suffix denotes the BGA Microstar configuration, whereas other suffixes like PGF indicate LQFP packages. All variants share identical core specifications and instruction sets.

Digital Signal Processor Dsp Replacement Considerations

TMS320VC5501PGF300: Same core and specs but uses LQFP-176 package. Requires PCB redesign due to different pinout and footprint.

TMS320VC5501GZZ300TMS320VC5501GZZ300

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