V10PWM63C-M3/I

Diode Arrays Overview

The V10PWM63C-M3/I is a high current density surface-mount TMBS rectifier manufactured by Vishay General Semiconductor. It features a SlimDPAK (TO-252AE) package with a typical height of 1.3 mm. The device provides a maximum repetitive peak reverse voltage of 60 V and a total maximum average forward rectified current of 10 A, split as 5 A per diode in its common cathode configuration. Peak forward surge current is rated at 80 A. Forward voltage drop is specified at 0.54 V at an ambient temperature of 125 °C when conducting 5 A per diode. The component operates within a junction temperature range of -40 to +175 °C.

Diode Arrays Feature Summary

• Utilizes Trench MOS Schottky technology for low forward voltage drop and reduced power losses.
• Features a very low profile case design suitable for automated placement processes.
• Meets MSL level 1 requirements with a maximum peak reflow temperature of 260 °C.

Diode Arrays Applications

• Low voltage high frequency DC/DC converters
• Freewheeling diodes
• Polarity protection applications

Diode Arrays Procurement Notes

Verify the specific ordering code against official Vishay documentation before procurement. Confirm that the suffix indicates compliance with halogen-free and RoHS standards. Ensure the delivery mode matches the required tape and reel specifications. Validate thermal resistance parameters against the intended PCB copper pad area to ensure proper heat dissipation during operation.

Diode Arrays Selection Notes

Select this component for designs requiring efficient rectification in compact surface-mount layouts. Consider the 1.3 mm profile constraint when determining board clearance. Evaluate the thermal performance based on the specific copper pad area available on the PCB, as thermal resistance varies significantly with mounting conditions. Verify that the 60 V rating accommodates peak reverse voltages in the target circuit.

Diode Arrays Part Context

This part belongs to the eSMP series of high current density surface-mount rectifiers from Vishay. It utilizes TMBS technology to achieve superior efficiency compared to standard Schottky diodes. The SlimDPAK package allows for higher current handling in a smaller footprint than traditional through-hole alternatives, making it suitable for modern dense electronic assemblies.

Diode Arrays Replacement Considerations

V10PWM63CHM3/I is an automotive qualified alternative within the same series.

Diode Arrays FAQ

What is the typical forward voltage drop at 125 °C?

The typical forward voltage drop is 0.44 V when conducting 2.5 A per diode at a junction temperature of 125 °C.

Is this component qualified for automotive applications?

Yes, an AEC-Q101 qualified version is available with the HM3 ordering suffix.

How does the copper pad area affect thermal performance?

Thermal resistance from junction to ambient decreases as the recommended copper pad area increases, improving heat dissipation capabilities.