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V15KM60C-M3/I is listed in the Diode Arrays range at ChipApex. The manufacturer field lists Vishay General Semiconductor - Diodes Division. Its product description is DIODE ARR SCHOT 60V 5.1A FLATPAK. Review the specifications below when checking this part for your BOM.
The V15KM60C-M3/I is a high current density surface-mount TMBS rectifier in a FlatPAK 5 x 6 package. It features a maximum repetitive peak reverse voltage of 60 V and an average forward current of 15 A (7.5 A per device). The instantaneous forward voltage is 0.42 V at 5 A and 0.47 V at 7.5 A when the junction temperature is 125 °C. Peak forward surge current reaches 140 A, with a maximum operating junction temperature range from -40 to +175 °C.
Verify the specific ordering suffix against official Vishay documentation before procurement. Confirm that the requested variant matches the required tape and reel dimensions and base quantity specifications. Ensure compliance with regional material categorization definitions and environmental directives as outlined in the manufacturer's datasheet.
Select this component for applications requiring low forward voltage drops at high currents within a compact surface-mount footprint. Evaluate thermal resistance parameters relative to the intended heatsinking or copper pad area to ensure the generated heat remains within safe operational limits for the junction-to-ambient configuration.
This part belongs to the V15KM series of high current density surface-mount TMBS rectifiers manufactured by Vishay General Semiconductor. The series is engineered to deliver robust performance for modern power supply designs where space constraints and thermal efficiency are critical factors in system architecture.
No public confirmed substitute part numbers are documented in the provided source material.
The typical junction capacitance is 1200 pF, measured at 4.0 V and 1 MHz.
The standard V15KM60C-M3/I does not explicitly state AEC-Q101 qualification; however, Vishay offers an available automotive ordering code (base P/N HM3) that meets these requirements.
Thermal resistance is specified as RθJA (junction-to-ambient) and RθJM (junction-to-mount), with values dependent on whether the device is mounted on an infinite heatsink or free air on a recommended copper pad area.
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