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The VSRAM-10-20-50-04-N is a vertical board-to-board connector from the AirBorn verSI series, designed for high-density interconnects. It features a 20-contact configuration with a 0.100-inch pitch and a 0.500-inch stack height. The component utilizes gold-plated contacts housed in liquid crystal polymer (LCP) to ensure signal integrity and durability. Rated for 200 volts, this open-pin field connector supports reliable performance in demanding electronic assemblies requiring robust mechanical stability.
Verify the specific suffix codes against manufacturer documentation to confirm material composition and plating specifications. Ensure compatibility with mating connectors regarding stack height and pin count. Confirm environmental ratings if operating in extreme conditions. Cross-reference part numbers with official AirBorn or Molex catalogs to avoid substitution errors.
Select this component based on the required 20-contact density and 0.100-inch pitch. Evaluate the 0.500-inch stack height against board spacing constraints. Consider the LCP housing material for thermal resistance. Verify voltage requirements align with the 200V rating. Assess mechanical load requirements for vertical mounting stability.
This connector belongs to the AirBorn verSI family, which offers various mounting styles including right-angle and cable I/O options. The series supports contact counts ranging from 40 to 500 in other variants. This specific model represents a mid-range configuration within the vertical mounting category, balancing density and stack height.
No public confirmed substitute part numbers are available.

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