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VVZ175-16IO7 is listed in the SCRs - Modules range at ChipApex. The manufacturer field lists IXYS. Its product description is RECT BRIDGE 3PH 167A 1600V PWSE2. Review the specifications below when checking this part for your BOM.
The VVZ175-16IO7 is a silicon SCR module manufactured by IXYS, designed for high-power applications. It features a PWS-E-2 screw mount package and supports an operating temperature range from -40°C to +125°C. Key electrical ratings include a rated repetitive off-state voltage (VDRM) of 1.6 kV and a non-repetitive on-state current capability of 1.6 kA. The module has an RMS on-state current rating of 89 A and a maximum holding current of 200 mA. Gate triggering requirements are specified at a maximum voltage of 1.5 V and a maximum current of 100 mA.
Verify the specific ordering suffix against the official manufacturer datasheet to confirm exact pinout and terminal configuration compatibility. Ensure that the gate trigger characteristics align with the control circuit design before integration. Confirm compliance with relevant environmental directives such as RoHS and REACH requirements for the intended market application.
Select this component when a high-voltage, high-current three-phase controlled rectification solution is required. The PWS-E-2 package offers a balance of current capacity and mounting simplicity for panel installations. Consider the 1.6 kV blocking voltage and 89 A RMS current ratings to ensure adequate headroom for the specific load profile and thermal dissipation constraints of the system design.
This device belongs to the VVZ175 series of thyristor modules from IXYS, which are engineered for robust performance in heavy-duty power electronics. The series utilizes advanced silicon technology to handle significant electrical stresses while maintaining stable operation across a wide temperature range, making it suitable for critical infrastructure and industrial machinery applications.
Consult the official IXYS datasheet for confirmed substitute part numbers or direct replacements within the same product family. Verify that any alternative component matches the critical electrical parameters, including voltage ratings, current capacities, and physical package dimensions, to ensure seamless integration without redesigning the host system.
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