SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —

Signal Relays Up to 2 Amps are an electromechanical device which turns a large load on or off through the use of a smaller control signal. The contacts on these devices have a rating of 10mA, 50mA, 200mA, 250mA, 400mA, 500mA, 1A, 1.25A, and 2A.
| Select products | Mfr | Description | Package | Supplier Device Package | Mounting Type | Series | Operating Temperature |
|---|---|---|---|---|---|---|---|
![]() J1MAW-12XL $62.82 | TE Connectivity Aerospace, Defense and Marine | RELAY GEN PURPOSE SPDT 1A 12V | Bulk | Through Hole | 1MA, CII | -65°C ~ 125°C | |
![]() J1MAW-12XM $67.18 | TE Connectivity Aerospace, Defense and Marine | RELAY GEN PURPOSE SPDT 1A 12V | Bulk | Through Hole | 1MA, CII | -65°C ~ 125°C | |
![]() J1MAW-12XP $71.34 | TE Connectivity Aerospace, Defense and Marine | RELAY GEN PURPOSE SPDT 1A 12V | Bulk | Through Hole | 1MA, CII | -65°C ~ 125°C | |
![]() J1MAW-18XP $81.28 | TE Connectivity Aerospace, Defense and Marine | RELAY GEN PURPOSE SPDT 1A 18V | Bulk,Tray | Through Hole | 1MA, CII | -65°C ~ 125°C | |
![]() J1MAW-26XL $62.82 | TE Connectivity Aerospace, Defense and Marine | RELAY GEN PURPOSE SPDT 1A 26.5V | Bulk | Through Hole | 1MA, CII | -65°C ~ 125°C | |
![]() J1MAW-26XP $71.74 | TE Connectivity Aerospace, Defense and Marine | RELAY GEN PURPOSE SPDT 1A 26.5V | Bulk | Through Hole | 1MA, CII | -65°C ~ 125°C | |
![]() J1MAW-5XP $71.74 | TE Connectivity Aerospace, Defense and Marine | RELAY GENERAL PURPOSE SPDT 1A 5V | Bulk | Through Hole | 1MA, CII | -65°C ~ 125°C | |
![]() J1MAW-6XM $62.68 | TE Connectivity Aerospace, Defense and Marine | RELAY GENERAL PURPOSE SPDT 1A 6V | Bulk | Through Hole | 1MA, CII | -65°C ~ 125°C |

See how a MEMS gyroscope measures angular rate, why its angle estimate drifts, and which range, noise, interface and temperature specs to compare.
Read More
In embedded design, the tug-of-war between cost and performance is constant. On one side, you have Microcontrollers (MCUs)—cheap, simple, and efficient. On the other,…
Read More
Munich, Germany – May 26, 2026 – Power semiconductor and automotive chip giant Infineon Technologies AG has formally notified customers worldwide of a second…
Read MoreLatest updates from leading semiconductor manufacturers: Wolfspeed launches new SiC modules, AMD reveals MI430X with HBM4, TSMC eyes third Japan fab, and Samsung samples…
Read More
In an era dominated by AI accelerators with terabytes of HBM memory and consumer devices racing toward LPDDR5X bandwidth, it’s easy to wonder: why…
Read More
Every audio power amplifier design starts with the same fundamental challenge: converting a low-voltage line-level signal into the high-current drive required by a reactive…
Read More
Recently, the global electronic component market has witnessed complex and changeable trends. In the memory chip sector, the wave of price increases continues to…
Read More
Embedded Integrated Circuit Modules: The Backbone of Modern Technology Embedded Integrated Circuit Modules (EICMs) have become an indispensable part of modern technology. Serving as…
Read MoreWilmington, Mass. & Milpitas, Calif. – May 19, 2026 – Analog Devices, Inc. (NASDAQ: ADI), a global leader in high-performance analog and mixed-signal semiconductors,…
Read More
If you’ve spent any time staring at a schematic, you’ve seen the triangle. Two inputs, one output, and a gain symbol that looks deceptively…
Read MoreDutch authorities announced on November 7 the lifting of control measures on Nexperia (formerly NXP Semiconductors’ Standard Products division), marking the end of a…
Read More
Geneva, Switzerland – March 25, 2026 – STMicroelectronics N.V. (NYSE: STM), a global semiconductor leader serving customers across the electronics applications spectrum, has announced…
Read More