SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —

Specialized Backplane Connectors conform to a set of specifications for use with daughterboards, midplane, coplanar, or front boards, and are meant to be used in a backplane or rack and panel system. They are characterized by the connector type, number of positions, pitch, number of rows, and contact layout.
| Select products | Mfr | Description | Package | Supplier Device Package | Mounting Type | Series | Operating Temperature |
|---|---|---|---|---|---|---|---|
| Amphenol ICC (FCI) | CONN HEADER XCEDE PCB | Bulk | Through Hole | XCede® | |||
| Amphenol ICC (FCI) | CONN HEADER XCEDE PCB | Bulk | Through Hole | XCede® | |||
![]() 10114508-B0J-10B $14.91 | Amphenol ICC (FCI) | XCEDE LEFT 6PVH 4COL NK | Tray | Through Hole | XCede® | ||
| Amphenol ICC (FCI) | CONN HEADER XCEDE PCB | Tray | Through Hole | XCede® | |||
![]() 10114508-B0J-20B $14.91 | Amphenol ICC (FCI) | XCEDE LEFT 6PVH 4COL NK | Tray | Through Hole | XCede® | ||
| Amphenol ICC (FCI) | CONN HEADER XCEDE PCB | Tray | Through Hole | XCede® | |||
| Amphenol ICC (FCI) | CONN HEADER XCEDE PCB | Bulk | Through Hole | XCede® | |||
| Amphenol ICC (FCI) | CONN HEADER XCEDE PCB | Bulk | Through Hole | XCede® |
SGM20MDS5NSS0000View Product
50004-1368EView Product
VSM-06-30-080-50-03-LView Product
1705251625View Product
4-6450130-3View Product
516-056-501-121View Product
51915-076LFView Product
HM1C01D2C010N9LFView Product
RM322-206-211-5570View Product
765603608View Product
GAPL41F0N0LB/AAView Product
10114508-J0J-10DLFView Product
Understand RF attenuator dB values, fixed and programmable types, impedance, power limits and noise tradeoffs before choosing parts for an RF signal path.
Read More
Learn why PTC resistance rises with temperature, how it differs from NTC, and which ratings matter for sensing and protection.
Read More
Tempe, Arizona‑based semiconductor giant Microchip Technology has formally rolled out selective product price increases across its MCU, power‑management IC, memory controller and analog component…
Read More
Monolithic Power Systems (MPS), a global leader in analog and mixed-signal semiconductors, has notified its distribution partners of an upcoming price increase for selected…
Read More
Recently, the global electronic component market has witnessed a series of new developments. The strategic layouts and market collaborations of major enterprises are constantly…
Read More
Learn how a pressure transducer converts pressure into voltage, current, or digital output, and compare pressure references and key selection specs.
Read More
Over the past week, the global electronic components sector has witnessed dual transformations in policy and technology: Coupled with mounting pressure from a worsening…
Read More
What Is NOR Flash? Why It Still Powers Critical Embedded Systems When your car’s engine control unit boots in milliseconds…When a medical device executes…
Read More
In the embedded world, general-purpose CPUs are great at running operating systems, and MCUs excel at logic control. But when you need to process…
Read More
The multilayer ceramic capacitor (MLCC) market has fallen into a severe structural supply crunch in the third quarter of 2026, driven by explosive demand…
Read More
[Shenzhen/Shanghai/Beijing, January 2025] — As global digital transformation accelerates, the electronic components industry has reached a critical inflection point in 2025. Emerging fields such…
Read More
Choose a DIP switch by contact type, coded positions, footprint and signal ratings. Check logic polarity, assembly conditions and PCB configuration behavior.
Read More