SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —

Specialized Backplane Connectors conform to a set of specifications for use with daughterboards, midplane, coplanar, or front boards, and are meant to be used in a backplane or rack and panel system. They are characterized by the connector type, number of positions, pitch, number of rows, and contact layout.
| Select products | Mfr | Description | Package | Supplier Device Package | Mounting Type | Series | Operating Temperature |
|---|---|---|---|---|---|---|---|
| Amphenol ICC (FCI) | CONN HEADER XCEDE PCB | Bulk | Through Hole | XCede® | |||
| Amphenol ICC (FCI) | CONN HEADER XCEDE PCB | Bulk | Through Hole | XCede® | |||
| Amphenol ICC (FCI) | CONN HEADER XCEDE PCB | Bulk | Through Hole | XCede® | |||
| Amphenol ICC (FCI) | CONN HEADER XCEDE PCB | Bulk | Through Hole | XCede® | |||
| Amphenol ICC (FCI) | CONN HEADER XCEDE PCB | Bulk | Through Hole | XCede® | |||
| Amphenol ICC (FCI) | CONN HEADER XCEDE PCB | Bulk | Through Hole | XCede® | |||
| Amphenol ICC (FCI) | CONN HEADER XCEDE PCB | Bulk | Through Hole | XCede® | |||
| Amphenol ICC (FCI) | CONN HEADER XCEDE PCB | Bulk | Through Hole | XCede® |

Learn how rectifiers convert AC to DC, compare half-wave and bridge circuits, and select voltage, current, recovery and thermal ratings for your design.
Read More
[Shenzhen/Shanghai/Beijing, January 2025] — As global digital transformation accelerates, the electronic components industry has reached a critical inflection point in 2025. Emerging fields such…
Read More
An RF IC, or radio-frequency integrated circuit, is a chip that processes wireless signals between the antenna and the baseband processor. Instead of building…
Read MoreTOKYO, July 31, 2026 — Renesas Electronics Corporation has officially announced a major domestic manufacturing restructuring, confirming plans to gradually discontinue all wafer fabrication…
Read MoreDutch authorities announced on November 7 the lifting of control measures on Nexperia (formerly NXP Semiconductors’ Standard Products division), marking the end of a…
Read More
Geneva, Switzerland – August 20, 2026 – Global leading semiconductor manufacturer STMicroelectronics (ST) has officially issued a new global price adjustment notice to global…
Read More-768x745.jpg)
CHICAGO, USA – May 27, 2026 – Global leading interconnect manufacturer Molex officially issued a global distributor price adjustment notice on May 27, confirming…
Read More
Compare Pt100 and Pt1000 RTDs, two-, three- and four-wire connections, excitation and self-heating. Build an error budget from element to reported temperature.
Read More
PLANO, Texas – March 20, 2026 – Diodes Incorporated (Nasdaq: DIOD), a leading global manufacturer and supplier of high-quality application-specific standard products in the…
Read More
Selecting the right microcontroller (MCU) isn’t just about specs—it’s about balancing performance, power, cost, and supply chain reliability. As an engineer, you’ve probably faced…
Read More
Understand RF attenuator dB values, fixed and programmable types, impedance, power limits and noise tradeoffs before choosing parts for an RF signal path.
Read More
In the vast landscape of memory technology, EEPROM (Electrically Erasable Programmable Read-Only Memory) often plays the unsung hero. While NAND Flash grabs headlines for…
Read More