SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —

Specialized Backplane Connectors conform to a set of specifications for use with daughterboards, midplane, coplanar, or front boards, and are meant to be used in a backplane or rack and panel system. They are characterized by the connector type, number of positions, pitch, number of rows, and contact layout.
| Select products | Mfr | Description | Package | Supplier Device Package | Mounting Type | Series | Operating Temperature |
|---|---|---|---|---|---|---|---|
| Amphenol ICC (FCI) | CONN RCPT HIGH SPEED 54P EDGE MT | Tube | Board Edge, Through Hole, Right Angle | Airmax VS2™ | |||
| Amphenol ICC (FCI) | CONN RCPT HI SPEED 120P EDGE MT | Tube | Board Edge, Through Hole, Right Angle | Airmax VS2™ | |||
| Amphenol ICC (FCI) | CONN RCPT HI SPEED 150P EDGE MT | Tube | Board Edge, Through Hole, Right Angle | Airmax VS2™ | |||
![]() 10124469-102LF $5.58 | Amphenol ICC (FCI) | CONN RCPT HIGH SPEED 54POS PCB | Tray | Through Hole | Airmax VS2™ | ||
| Amphenol ICC (FCI) | CONN RCPT HIGH SPEED 150POS PCB | Bulk | Through Hole | Airmax VS2™ | |||
| Amphenol ICC (FCI) | CONN HDR HI SPEED 90POS EDGE MT | Bulk | Board Edge, Through Hole, Right Angle | Airmax VSe® | |||
| Amphenol ICC (FCI) | CONN HDR HI SPEED 150POS EDGE MT | Tube | Board Edge, Through Hole, Right Angle | Airmax VSe® | |||
| Amphenol ICC (FCI) | CONN HDR HI SPEED | Tube | Board Edge, Through Hole, Right Angle | Airmax VSe® |
RM452-110-321-0256View Product
10133085-102LFView Product
51741-10002004AALFView Product
516-090-501-152View Product
10113947-J0C-40DLFView Product
10105004-104LFView Product
50332-1165EView Product
72377-9021LFView Product
737803946View Product
HM1W52ZTRB69H6View Product
51812-10400000AALFView Product
89094-902LFView Product
TOKYO — Global leading semiconductor and power electronic components manufacturer Renesas Electronics officially issued a new price adjustment notice in early September 2026, confirming…
Read More
If you’ve spent any time staring at a schematic, you’ve seen the triangle. Two inputs, one output, and a gain symbol that looks deceptively…
Read More
TOKYO, April 1, 2026 – Kioxia Corporation (formerly Toshiba Memory Corporation), a global leader in flash memory and storage solutions, has officially issued a…
Read More
Learn why PTC resistance rises with temperature, how it differs from NTC, and which ratings matter for sensing and protection.
Read MoreRecently, global semiconductor manufacturers have been constantly making moves in aspects such as technological cooperation, product manufacturing processes, and market layout, demonstrating the rapid…
Read More
In embedded design, the tug-of-war between cost and performance is constant. On one side, you have Microcontrollers (MCUs)—cheap, simple, and efficient. On the other,…
Read More
Embedded Integrated Circuit Modules: The Backbone of Modern Technology Embedded Integrated Circuit Modules (EICMs) have become an indispensable part of modern technology. Serving as…
Read More
In the world of electronics, memory components play a critical role in system performance—and DRAM (Dynamic Random-Access Memory) is one of the most widely…
Read MoreMay 4, 2026 — The global power semiconductor market is grappling with a worsening supply crunch, as lead times for key components have extended…
Read More
Tokyo / Munich / Tessenderlo, December 24, 2025As the global semiconductor industry enters the first year of the 2nm process era, international electronic component…
Read More
Choose a DIP switch by contact type, coded positions, footprint and signal ratings. Check logic polarity, assembly conditions and PCB configuration behavior.
Read MoreSeptember 16, 2026 – Global — Leading semiconductor manufacturer ON Semiconductor (onsemi, NASDAQ: ON) has officially issued a formal price adjustment letter to global…
Read More