Unclassified

Select products	Mfr	Description	Package	Series
1302030271 $4.28	Molex	MIC 5P FI (NYLON) PLAIN	Bulk	*
1302030272 $2.41	Molex	MIC 2P FI (NYLON) PLAIN	Bulk	*
1302030291 $9.24	Molex	MIC 2P MALE INSERT AC PORT	Bulk	*
1302030294 $2.51	Molex	MIC 5P MALE INSERT AC PORT	Bulk	*
1302030295 $3.42	Molex	MIC 6P MALE INSERT AC PORT	Bulk	*
1302030515 $30.65	Molex	LAMP GUARD TUBE WT3F 6.14INLONGX	Bulk	*
1302030518 $270.09	Molex	TUBE-LAMP GUARD	Bulk	*
1302030628 $142.17	Molex	HANDLE VAPORTEX	Bulk	*

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Rocker switch selection: ratings, illumination and panel fit

Choose a rocker switch by AC/DC ratings, contact arrangement, illumination, panel fit and sealing. Get practical checks for engineering and component sourcing.

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2025 Semiconductor Industry: Supply Chain Turmoil, Rise of Third-Generation Materials, and “Hot-Cold Differentiation” in Demand

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Choose logic inverter ICs by thresholds, supply, output drive and delay. Compare standard and Schmitt-trigger inputs, power sequencing and replacement checks.

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EEPROM Guide: Byte-Level Non-Volatile Storage | ChipApex

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What Is EEPROM? A Deep Dive into Byte-Level Data Storage | ChipApex

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Sep 25, 2025

Samsung’s HBM3E chips have passed NVIDIA’s certification, and SK Hynix has completed the development of HBM4 chips.

On September 22nd, it was reported that Samsung Electronics, the South Korean tech giant, had successfully passed NVIDIA’s certification test for its 12-layer HBM3E…

Renesas Second Price Hike 2026 | New Pricing Effective January 1, 2027

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Renesas Unveils Second 2026 Price Hike, New Rates Effective Jan 1, 2027

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Temperature sensor types: thermistor, RTD, thermocouple and IC

Compare thermistors, RTDs, thermocouples and temperature ICs. Learn how range, accuracy, response, interfaces and mounting affect component selection.

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Recent News

The Future of Electronics: Breakthroughs in Electronic Components Technology

Texas Instruments Announces New Round of Price Adjustments Effective July 1, 2026

Infineon Announces Price Increase: Power Device Prices to Rise Effective April 1, Driven by Surging AI Demand and Mounting Cost Pressures

Rocker switch selection: ratings, illumination and panel fit

2025 Semiconductor Industry: Supply Chain Turmoil, Rise of Third-Generation Materials, and “Hot-Cold Differentiation” in Demand

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Samsung’s HBM3E chips have passed NVIDIA’s certification, and SK Hynix has completed the development of HBM4 chips.

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Temperature sensor types: thermistor, RTD, thermocouple and IC

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