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Connectors of this type have contacts arranged in linear rows and an outline which is generally rectangular, rather than circular. They are used for creating pluggable connections directly between printed circuit boards without use of wire or cable, and can provide a large number of electrical connections in a relatively small space. For this reason they are commonly used to connect components of space-constrained systems.
| Select products | Mfr | Description | Package | Supplier Device Package | Mounting Type | Series | Operating Temperature |
|---|---|---|---|---|---|---|---|
![]() 750030308 $5.67 | Molex | CONN DIFF ARRAY PLG 12P SMD GOLD | Tube | Surface Mount | Plateau HS Mezz 75003 | ||
| Molex | CONN DIFF ARRAY PLG 12P SMD GOLD | Tube | Surface Mount | Plateau HS Mezz 75003 | |||
![]() 750050006 $7.09 | Molex | CONN DIFF ARRAY RCP 24P SMD GOLD | Tape & Reel (TR) | Surface Mount | Plateau HS Mezz 75005 | ||
![]() 750050104 $10.80 | Molex | CONN DIFF ARRAY RCP 48P SMD GOLD | Tape & Reel (TR) | Surface Mount | Plateau HS Mezz 75005 | ||
![]() 750050204 $15.28 | Molex | CONN DIFF ARRAY RCP 72P SMD GOLD | Tape & Reel (TR) | Surface Mount | Plateau HS Mezz 75005 | ||
![]() 750050304 $12.79 | Molex | CONN DIFF ARRAY RCP 12P SMD GOLD | Tape & Reel (TR),Cut Tape (CT) | Surface Mount | Plateau HS Mezz 75005 | ||
![]() 750050306 $5.97 | Molex | CONN DIFF ARRAY RCP 12P SMD GOLD | Tape & Reel (TR) | Surface Mount | Plateau HS Mezz 75005 | ||
![]() 750052100 $4.95 | Molex | CONN DIFF ARRAY RCPT 6 PAIR | Bulk | - | Plateau HS Mezz 75005 |
1-1658071-5View Product
SEAF-30-06.5-L-08-2-A-K-TRView Product
SEAF-40-06.0-L-05-2-A-K-TRView Product
3-1939755-6View Product
ADM6-10-01.5-L-4-0-A-TRView Product
FSI-120-06-L-D-M-AD-PView Product
P08-050HLTC-E-GView Product
QTE-040-06-F-D-AView Product
61082-122702LFView Product
SEAF8-30-05.0-S-08-2-KView Product
SEAM-50-01-S-06-1-RA-GP-K-TRView Product
G832MB010605222HRView Product
Choose a DIP switch by contact type, coded positions, footprint and signal ratings. Check logic polarity, assembly conditions and PCB configuration behavior.
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