SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —

Backplane connectors are used in high-reliability applications such as computer buses and often employ secure fastening hardware for board, free-hanging, through-hole, and panel mounting depending on the contact used. Included in this category are accessories, ARINC, contacts, housings, specialized, and more.
| Select products | Mfr | Description | Package | Supplier Device Package | Mounting Type | Series | Operating Temperature |
|---|---|---|---|---|---|---|---|
| Amphenol ICC (FCI) | CONN HEADER XCEDE PCB | Bulk | Through Hole | XCede® | |||
| Amphenol ICC (FCI) | CONN HEADER XCEDE PCB | Bulk | Through Hole | XCede® | |||
| Amphenol ICC (FCI) | CONN HEADER XCEDE PCB | Bulk | Through Hole | XCede® | |||
| Amphenol ICC (FCI) | CONN HEADER XCEDE PCB | Bulk | Through Hole | XCede® | |||
| Amphenol ICC (FCI) | CONN HEADER XCEDE PCB | Bulk | Through Hole | XCede® | |||
| Amphenol ICC (FCI) | CONN HEADER XCEDE PCB | Bulk | Through Hole | XCede® | |||
| Amphenol ICC (FCI) | CONN HEADER XCEDE PCB | Bulk | Through Hole | XCede® | |||
| Amphenol ICC (FCI) | CONN HEADER XCEDE PCB | Bulk | Through Hole | XCede® |
A-BF32AW5-1View Product
SGM7MSCNSS0000View Product
2B22M154P1001-1-HView Product
M28748/3-E00F2AView Product
A-CF64ABTView Product
459858282View Product
DIN-064CSB-R3L-HMView Product
HM2S10PE51N0N9LFView Product
86093960892755E1LFView Product
10114868-Y0J-70BView Product
10148426-102LFView Product
178072095000517+View Product
Choose an AC to DC converter by input range, output demand, isolation, efficiency and thermal derating. Compare architectures and check installation needs.
Read More
PLANO, Texas – March 20, 2026 – Diodes Incorporated (Nasdaq: DIOD), a leading global manufacturer and supplier of high-quality application-specific standard products in the…
Read More
Vishay Intertechnology, Inc., a global leader in discrete semiconductors and passive electronic components, has officially announced a price adjustment for its Metal-Oxide-Semiconductor Field-Effect Transistors…
Read MoreLas Vegas, January 6, 2026 — At the Consumer Electronics Show (CES) 2026, Texas Instruments (TI) (NASDAQ: TXN) announced a suite of next-generation semiconductor…
Read More
Understand how oscillators generate timing signals, how they differ from crystals, and which frequency, output and stability specs matter when choosing one.
Read More
An RF IC, or radio-frequency integrated circuit, is a chip that processes wireless signals between the antenna and the baseband processor. Instead of building…
Read More
Over the past week, the global electronic components sector has witnessed dual transformations in policy and technology: Coupled with mounting pressure from a worsening…
Read More
In the vast landscape of memory technology, EEPROM (Electrically Erasable Programmable Read-Only Memory) often plays the unsung hero. While NAND Flash grabs headlines for…
Read More
Munich, Germany – February 8, 2026 — Infineon Technologies, the German semiconductor giant, officially issued a price increase notice on February 5, announcing that…
Read More
Compare RC, crystal and MEMS oscillator circuits. Check ppm, jitter, load capacitance, startup margin and output compatibility before choosing a clock source.
Read More
Compare thermistors, RTDs, thermocouples and temperature ICs. Learn how range, accuracy, response, interfaces and mounting affect component selection.
Read More
Select MOV varistors by continuous voltage, clamping behavior, surge waveform and repetition. Check thermal disconnection, fuse coordination and replacements.
Read More