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— IC芯片 | 连接器 | 传感器 | 被动器件 —

Products in the modular embedded processor family integrate a microcontroller, microprocessor, digital signal processor, FPGA, or other such computational device together with support components such as memory, power management, timing, and other items necessary for their operation. They are suitable and intended for integration into an end product, and offer product developers access to modern computational and interface capabilities without necessity of high speed hardware design experience.
OSD3358-512M-BCBView Product
MYC-LR3576J-64E8D-160-IView Product
EZ80L925048MODGView Product
TE0813-01-5DE11-AView Product
TE0745-03-81C31-AView Product
TE0727-04-41C34View Product
A20-SOM-E16GS16MView Product
TE0713-03-82C46-AView Product
ME-XU9-7EV-2E-D13E-R2.1View Product
TE0722-02IView Product
TE0808-05-9BE81-AView Product
3354-HX-X38-RIView ProductNXP Semiconductors (NASDAQ: NXPI), a global leader in automotive, industrial, and IoT semiconductors, has officially notified customers of an upcoming price adjustment for select…
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TOKYO — Global leading semiconductor and power electronic components manufacturer Renesas Electronics officially issued a new price adjustment notice in early September 2026, confirming…
Read MoreSeptember 16, 2026 – Global — Leading semiconductor manufacturer ON Semiconductor (onsemi, NASDAQ: ON) has officially issued a formal price adjustment letter to global…
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The global electronics industry is facing an escalating shortage of tantalum capacitors, a critical passive component, as surging demand from AI servers, automotive electronics,…
Read MoreMay 4, 2026 — The global power semiconductor market is grappling with a worsening supply crunch, as lead times for key components have extended…
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Munich, Germany – February 8, 2026 — Infineon Technologies, the German semiconductor giant, officially issued a price increase notice on February 5, announcing that…
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Date: May 13, 2026 The global memory industry is facing an unprecedented supply crunch in legacy MLC NAND Flash. Leading manufacturers including Samsung Electronics…
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Manchester, New Hampshire, USA – March 22, 2026 – Allegro MicroSystems, Inc. (Nasdaq: ALGM), a global leader in high-performance power and sensing semiconductor solutions…
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Understand RF attenuator dB values, fixed and programmable types, impedance, power limits and noise tradeoffs before choosing parts for an RF signal path.
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In the world of electronics, memory components play a critical role in system performance—and DRAM (Dynamic Random-Access Memory) is one of the most widely…
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Over the past week, the global electronic components sector has witnessed dual transformations in policy and technology: Coupled with mounting pressure from a worsening…
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CHICAGO, USA – May 27, 2026 – Global leading interconnect manufacturer Molex officially issued a global distributor price adjustment notice on May 27, confirming…
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