SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —

Film capacitors are based on the use of plastic film materials as a dielectric. An electrostatic (non-polarized) capacitor type having generally favorable parameter stability and loss characteristics relative to other types, a wide variety of construction and material variations exist that allow film capacitors to be adapted for a wide range of purposes, ranging from small-signal applications in which ceramics are competitive to power applications where electrolytics are the likely alternative.
| Select products | Mfr | Description | Package | Supplier Device Package | Mounting Type | Series | Operating Temperature |
|---|---|---|---|---|---|---|---|
![]() B32562J6474M289 $0.27 | EPCOS - TDK Electronics | CAP FILM 0.47UF 20% 400VDC 2DIP | Tape & Box (TB) | Through Hole | B3256* - MKT SilverCap™ | -55°C ~ 125°C | |
![]() B32562J6683J000 $0.14 | EPCOS - TDK Electronics | CAP FILM 0.068UF 5% 400VDC 2DIP | Bulk | Through Hole | B3256* - MKT SilverCap™ | -55°C ~ 125°C | |
![]() B32562J6684J000 $0.38 | EPCOS - TDK Electronics | CAP FILM 0.68UF 5% 400VDC 2DIP | Bulk | Through Hole | B3256* - MKT SilverCap™ | -55°C ~ 125°C | |
![]() B32562J6684K000 $0.99 | EPCOS - TDK Electronics | CAP FILM 0.68UF 10% 400VDC 2DIP | Bulk | Through Hole | B3256* - MKT SilverCap™ | -55°C ~ 125°C | |
![]() B32562J6684K289 $0.36 | EPCOS - TDK Electronics | CAP FILM 0.68UF 10% 400VDC 2DIP | Tape & Box (TB) | Through Hole | B3256* - MKT SilverCap™ | -55°C ~ 125°C | |
![]() B32562J8104J000 $0.29 | EPCOS - TDK Electronics | CAP FILM 0.1UF 5% 630VDC 2DIP | Bulk | Through Hole | B3256* - MKT SilverCap™ | -55°C ~ 125°C | |
| EPCOS - TDK Electronics | CAP FILM 0.15UF 5% 630VDC 2DIP | Bulk | Through Hole | B3256* - MKT SilverCap™ | -55°C ~ 125°C | ||
![]() B32562J8154J289 $0.36 | EPCOS - TDK Electronics | CAP FILM 0.15UF 5% 2DIP | Tape & Box (TB) | Through Hole | B3256* - MKT SilverCap™ | -55°C ~ 125°C |

Samsung Electronics, the world’s largest memory chip manufacturer, has officially confirmed the end-of-life (EOL) for its LPDDR4 and LPDDR4X low-power DRAM products, marking a…
Read More
Learn how a pressure transducer converts pressure into voltage, current, or digital output, and compare pressure references and key selection specs.
Read More
ChipApex – May 8, 2026 Texas Instruments (TI), the global leader in analog and embedded semiconductors, has officially notified customers of an upcoming company-wide…
Read More
Explore electronic component types, functions, packages and datasheets. Learn selection, replacement and BOM checks before ordering parts for your PCB.
Read More
Find out when a bare shock switch needs a pull resistor, when an MCU internal pull-up is enough, and why sensor modules and piezo…
Read More
A perfect storm of surging demand and supply chain disruptions is roiling the global electronic components market, with advanced semiconductors and critical materials now…
Read More-768x745.jpg)
CHICAGO, USA – May 27, 2026 – Global leading interconnect manufacturer Molex officially issued a global distributor price adjustment notice on May 27, confirming…
Read More
In the vast landscape of memory technology, EEPROM (Electrically Erasable Programmable Read-Only Memory) often plays the unsung hero. While NAND Flash grabs headlines for…
Read More
In the embedded world, general-purpose CPUs are great at running operating systems, and MCUs excel at logic control. But when you need to process…
Read More
Recently, a survey by the Electronic Components Industry Association (ECIA) revealed that the sales sentiment of global electronic components remained optimistic in the third…
Read More
WILMINGTON, Mass. – August 11, 2026 — Analog Devices, Inc. (NASDAQ: ADI), the global leading supplier of high-performance analog, mixed-signal and digital signal processing…
Read MoreLatest updates from leading semiconductor manufacturers: Wolfspeed launches new SiC modules, AMD reveals MI430X with HBM4, TSMC eyes third Japan fab, and Samsung samples…
Read More