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2N3702 TRE TIN/LEAD is listed in the Single Bipolar Transistors range at ChipApex. The manufacturer field lists Central Semiconductor Corp. Its product description is 25V 200MA 360MW TH TRANSISTOR-SM. Review the specifications below when checking this part for your BOM.
The 2N3702 TRE TIN/LEAD is a small signal PNP bipolar junction transistor manufactured by Central Semiconductor. It utilizes silicon technology and is housed in a TO-92 cylindrical package with three through-hole terminals. The device supports a maximum collector-emitter voltage of 25 V and a maximum collector current of 0.5 A. Key electrical specifications include a minimum DC current gain (hFE) of 60, a collector-base capacitance of 12 pF, and a power dissipation rating of 625 mW. The component operates within a temperature range up to 150 °C.
Verify the specific ordering suffix to confirm lead-free status and terminal plating composition. Ensure the procurement documentation explicitly states compliance with relevant environmental directives. Confirm that the received components match the specified TO-92 package dimensions and pinout configuration before integration into production assemblies.
Select this component when a low-voltage PNP transistor is required for discrete circuit designs. The TO-92 package facilitates easy manual or automated insertion. Consider the 25 V voltage rating and 0.5 A current limit to ensure adequate headroom for the intended load conditions and operating environment.
This part belongs to the 2N3702 family of small signal transistors produced by Central Semiconductor. The manufacturer offers variations in packaging and termination materials, such as bulk or tape-and-reel formats. The specific model denotes a tin/lead terminal finish, distinguishing it from lead-free alternatives within the same product line.
Cross-reference with other 2N3702 equivalents from different manufacturers. Verify that substitute parts maintain identical pin configurations and meet or exceed the original voltage and current ratings. Confirm package compatibility to ensure physical fit without modification.
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