71T75802S166PFGI8

Memory IC Overview

The 71T75802S166PFGI8 is a synchronous static random-access memory (SRAM) integrated circuit manufactured by Renesas Electronics. It features an 18 Mbit storage capacity organized as 1M x 18 bits. The device supports a maximum clock frequency of 200 MHz with a typical access time of 3.2 ns. It operates on a single 2.5 V power supply and utilizes a parallel interface. The component is housed in a 119-pin plastic ball grid array (PBGA) package.

Memory IC Feature Summary

• Supports high-speed data transfer via a 200 MHz synchronous clock interface
• Provides 18 Mbit density for efficient data buffering and caching applications
• Utilizes Zero Bus Turnaround (ZBT) technology to minimize bus turnaround latency

Memory IC Applications

• High-performance networking equipment requiring low-latency memory
• Industrial control systems utilizing 2.5V core logic
• Telecommunications infrastructure base stations

Memory IC Procurement Notes

Verify the specific suffix PFGI8 against official Renesas documentation to confirm pinout and electrical characteristics, as suffixes define package type and temperature range. Confirm availability status through authorized distributors, as this component may be subject to end-of-life restrictions or limited stock conditions. Ensure compatibility with existing PCB footprints for the 119-PBGA package before procurement.

Memory IC Selection Notes

Select this component when a 2.5V synchronous SRAM with 1M x 18 organization is required. Compare access times and clock frequencies against alternative models within the 71T75802 series if different speed grades are needed. Verify that the PBGA-119 package fits the design constraints and that the operating temperature range meets the application requirements.

Memory IC Part Context

This part belongs to the Renesas 71T75802 series of synchronous ZBT SRAMs. The series offers various speed grades and package options, including TQFP and BGA configurations. These devices are designed for applications demanding fast memory access and low power consumption in embedded systems.

Memory IC Replacement Considerations

Publicly confirmed substitute part numbers for this specific component were not identified in the provided source material.