ATP401-TL-H

Single FETs, MOSFETs Overview

The ATP401-TL-H is a single N-channel enhancement mode power MOSFET manufactured by onsemi. It utilizes silicon technology and is housed in the ATPAK-3 surface-mount package. Key electrical parameters include a drain-to-source voltage of 60 V, a continuous drain current of 100 A, and a maximum gate-to-source voltage of ±20 V. The device features a typical static drain-to-source on-state resistance (RDS(on)) of 2.8 mΩ at VGS=10V and 50A. Additional specifications include a total gate charge of 300 nC, an allowable power dissipation of 90 W at 25°C case temperature, and an operating junction temperature range up to 150°C.

Single FETs, MOSFETs Feature Summary

• Low on-state resistance for efficient power switching
• High continuous and pulsed drain current capability
• Compatible with standard logic-level drive voltages

Single FETs, MOSFETs Applications

• DC-DC converter circuits
• Motor control systems
• Power supply output stages

Single FETs, MOSFETs Procurement Notes

Verify component authenticity through authorized distribution channels. Confirm that the specific ordering suffix matches the required packaging configuration. Ensure compliance with RoHS and halogen-free standards as specified in the datasheet. Check for End-of-Life status or alternative part recommendations from the manufacturer before finalizing procurement plans.

Single FETs, MOSFETs Selection Notes

Select this component based on the required voltage rating and current handling capacity for the target application. Consider the thermal management requirements given the power dissipation limits and package type. Evaluate the gate charge characteristics against the driving circuit capabilities to ensure adequate switching speed. Verify that the package dimensions fit the available PCB layout constraints.

Single FETs, MOSFETs Part Context

This device belongs to the ATP401 series of power MOSFETs from onsemi. It is designed for general-purpose power switching applications requiring low conduction losses. The ATPAK package provides a compact form factor suitable for high-density board designs while offering robust thermal performance.

Single FETs, MOSFETs Replacement Considerations

Consult the manufacturer's official documentation for verified substitute part numbers. Cross-reference key parameters such as voltage, current, and package type when evaluating alternatives.