SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The CBP128 is a bottom plate manufactured by Hoffman Enclosures, Inc., designed for use with compatible enclosure systems. It measures 1200mm in length and 800mm in width. The component weighs approximately 17.00 lbs (7.7 kg). It serves as a foundational accessory for assembling machine parts and enclosure structures.
Verify compatibility with specific Hoffman enclosure models before purchase. Confirm dimensional requirements match the intended installation space. Check for surface finish specifications if environmental exposure is a concern. Ensure the weight capacity of the supporting structure accommodates the plate's mass. Review official documentation for any updated mounting hole patterns or interface changes.
Select this component when a standardized bottom plate is required for 1200x800mm enclosure configurations. Consider material durability and corrosion resistance relative to the operating environment. Evaluate whether additional accessories like hinges or latches are needed for complete assembly. Compare against alternative base solutions for cost and performance trade-offs.
This part belongs to the Hoffman Enclosures product line, which offers customizable solutions for safeguarding electrical equipment. The brand provides various enclosures, climate controls, and accessories to optimize material and labor through automated modification processes.
No public confirmed substitute part numbers are available in the provided data.

What Is NOR Flash? Why It Still Powers Critical Embedded Systems When your car’s engine control unit boots in milliseconds…When a medical device executes…
Read More
WILMINGTON, Mass. – August 11, 2026 — Analog Devices, Inc. (NASDAQ: ADI), the global leading supplier of high-performance analog, mixed-signal and digital signal processing…
Read More
Choose a DIP switch by contact type, coded positions, footprint and signal ratings. Check logic polarity, assembly conditions and PCB configuration behavior.
Read More
Learn the relay definition, coil and contact operation, NO and NC forms, load ratings and suppression choices. Compare mechanical, reed and solid-state types.
Read MoreNXP Semiconductors (NASDAQ: NXPI), a global leader in automotive, industrial, and IoT semiconductors, has officially notified customers of an upcoming price adjustment for select…
Read More
Learn what a battery BMS does, how protection differs from charging, and which pack specifications to check when sourcing BMS components through ChipApex.
Read MoreDutch authorities announced on November 7 the lifting of control measures on Nexperia (formerly NXP Semiconductors’ Standard Products division), marking the end of a…
Read More
In the world of electronics, memory components play a critical role in system performance—and DRAM (Dynamic Random-Access Memory) is one of the most widely…
Read MoreTOKYO, July 31, 2026 — Renesas Electronics Corporation has officially announced a major domestic manufacturing restructuring, confirming plans to gradually discontinue all wafer fabrication…
Read More
On September 22nd, it was reported that Samsung Electronics, the South Korean tech giant, had successfully passed NVIDIA’s certification test for its 12-layer HBM3E…
Read More
Compare SPST and SPDT toggle switches, understand AC/DC ratings, and follow wiring examples. Check contact action, mounting and parts in the ChipApex catalog.
Read More
Understand RF attenuator dB values, fixed and programmable types, impedance, power limits and noise tradeoffs before choosing parts for an RF signal path.
Read More