DD390N22STIMHPSA1

Diode Arrays Overview

The DD390N22STIMHPSA1 is a high-power rectifier diode module from Infineon's Prime Block series, utilizing L#T-BOND technology. It features a 50 mm package with screw mounting and pre-applied thermal interface material (TIM). Key electrical parameters include a repetitive peak reverse voltage of 2200 V and an average forward current rating of 390 A at 180° electrical sine wave operation. The module exhibits a maximum forward voltage drop of 0.81 V and a low on-state resistance of 0.3 mΩ. Thermal performance is characterized by a junction-to-case thermal resistance of 0.086 K/W, supporting a maximum junction temperature of 150 °C.

Diode Arrays Feature Summary

• Integrates L#T-BOND wire bonding technology for robust electrical connections and enhanced reliability under high power cycling conditions.
• Comes with factory-applied thermal interface material to simplify assembly and ensure consistent thermal contact between the module baseplate and heatsink.
• Designed with a rugged 50 mm housing structure optimized for efficient heat dissipation in demanding industrial environments.

Diode Arrays Applications

• High-power industrial motor drives and frequency converters
• Uninterruptible power supplies (UPS) and static transfer switches
• Welding machines and heavy-duty rectification systems

Diode Arrays Procurement Notes

Verify the complete part number including suffixes such as HPSA1 against official Infineon documentation to confirm specific manufacturing variants and compliance status. Ensure that the procurement channel provides valid traceability documents. Confirm that the received units match the specified L#T-BOND construction and TIM application details before integration into final assemblies.

Diode Arrays Selection Notes

Select this component when designing circuits requiring high voltage blocking capability combined with significant continuous current handling. The integrated thermal interface material reduces system assembly time but requires compatible mating surfaces. Evaluate the thermal resistance specifications against the intended heatsinking solution to maintain junction temperatures within safe operating limits during peak load conditions.

Diode Arrays Part Context

This device belongs to the Prime Block family of high-power semiconductor modules, representing Infineon's advanced silicon technology for rectification applications. The series is engineered for durability in harsh electrical environments, offering superior short-circuit withstand capability compared to standard discrete solutions. It serves as a critical component in converting AC to DC power for large-scale industrial machinery.

Diode Arrays Replacement Considerations

Direct replacements must match the 2200 V voltage class and 390 A current rating. Verify pinout compatibility and mechanical dimensions of alternative modules. Consider upgrading to newer generations if improved thermal performance or higher current density is required for the specific application design.