DSC1103AI2-100.0000

Oscillators Overview

The DSC1103AI2-100.0000 is a MEMS-based XO oscillator manufactured by Microchip Technology, operating at a frequency of 100 MHz with an output format of LVDS. It supports a supply voltage range of 2.25V to 3.63V and features a standby function for power management. The device exhibits a frequency stability of ±25 ppm and operates within a temperature range of -40°C to +85°C. Maximum supply current is 32 mA. It utilizes a 6-VDFN package with dimensions of 7.00mm x 5.00mm x 0.90mm maximum height.

Oscillators Feature Summary

• Utilizes MEMS technology for high-performance oscillation
• Provides LVDS output signal format
• Supports standby mode for power reduction

Oscillators Applications

• High-speed data transmission systems
• Telecommunications equipment
• Network infrastructure components

Oscillators Procurement Notes

Verify the specific suffix 'AI2' against official Microchip documentation to confirm pinout compatibility and electrical characteristics. Ensure the required frequency tolerance of ±25 ppm aligns with system timing requirements. Confirm that the 6-VDFN footprint matches the target PCB layout specifications before finalizing procurement decisions.

Oscillators Selection Notes

Select this component when LVDS signaling is required for noise immunity in high-frequency applications. Consider the ±25 ppm stability specification relative to clock jitter requirements. Evaluate the 7.00mm x 5.00mm package size against available board space constraints compared to smaller variants in the DSC1103 series.

Oscillators Part Context

This part belongs to the DSC1103 family of precision MEMS oscillators from Microchip Technology. The family offers various output formats and stability options. This specific model provides a balance of performance and size, utilizing the AI2 suffix to denote specific packaging and stability parameters within the broader product line.

Oscillators Replacement Considerations

DSC1103AI2-100.0000T is a parameter-equivalent alternative offering tape-and-reel packaging instead of individual units. Verify if the reel configuration suits automated assembly processes while maintaining identical electrical specifications.