FFB20UP30DNTPTM

Diode Arrays Overview

The FFB20UP30DNTPTM is a general-purpose diode array manufactured by onsemi, housed in a TO-263 (D2PAK) surface-mount package. It features a maximum repetitive peak reverse voltage of 300 V and a continuous forward current rating of 10 A. The device utilizes ultrafast recovery technology to minimize switching losses and reverse recovery charge. Designed for high-efficiency power conversion applications, it offers robust thermal performance with a maximum junction temperature rating of +175 °C. The component is constructed using silicon material and provides reliable operation across a wide temperature range from -55 °C to +175 °C.

Diode Arrays Feature Summary

• Ultrafast recovery characteristics for efficient switching
• High voltage blocking capability up to 300 V
• Robust 10 A continuous forward current handling
• Extended thermal stability with +175 °C junction rating

Diode Arrays Applications

• High-frequency DC-DC converters
• Free-wheeling rectification in power supplies
• Clamping diodes in motor drive circuits
• General-purpose rectification in industrial electronics

Diode Arrays Procurement Notes

Verify the specific suffix 'PTM' against the official datasheet to confirm tape-and-reel packaging specifications. Ensure the ordering part number matches the exact electrical parameters required for the target application. Cross-reference the manufacturer's latest documentation to confirm active status and any potential lifecycle changes or obsolescence notices before finalizing procurement plans.

Diode Arrays Selection Notes

Select this component when high-voltage isolation and fast switching speeds are critical. The 300 V rating suits medium-voltage systems, while the 10 A capacity supports moderate power loads. Consider the D2PAK package for its balance of thermal dissipation and board space efficiency. Evaluate the ultrafast recovery time against the system's switching frequency to ensure minimal reverse recovery losses and electromagnetic interference.

Diode Arrays Part Context

This diode array belongs to onsemi's portfolio of standard discrete semiconductor products. It complements the company's broader range of power management and protection devices used in automotive, industrial, and sustainable energy sectors. The component supports designs requiring reliable, high-speed rectification within compact surface-mount form factors, aligning with industry trends toward miniaturization and enhanced power density.

Diode Arrays Replacement Considerations

Consult official cross-reference guides for direct substitutes with matching 300 V, 10 A, and ultrafast recovery specifications. Verify pinout compatibility and thermal resistance values to ensure seamless integration without redesigning the PCB layout or heat sinking infrastructure.

Diode Arrays FAQ

What is the maximum operating junction temperature?

The maximum operating junction temperature is +175 °C.

Is this component available in a through-hole package?

No, the FFB20UP30DNTPTM is specifically designed for surface-mount installation in a TO-263 (D2PAK) package.