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FSTU3384QSCX is listed in the Signal Switches, Multiplexers, Decoders range at ChipApex. The manufacturer field lists onsemi. Its product description is IC BUS SWITCH 5 X 1:1 24QSOP. Review the specifications below when checking this part for your BOM.
The FSTU3384QSCX is a 10-bit bus switch manufactured by onsemi, housed in a 24-lead Quarter Size Outline Package (QSOP). It operates within a supply voltage range of 4.0V to 5.5V and supports an operating temperature from -40°C to +85°C. The device features two independent 5-bit switches with separate enable signals, providing a typical on-resistance of 4Ω at 4.5V. It includes integrated undershoot hardened circuit protection capable of withstanding input voltages down to -2.0V.
Verify the specific package designation QSOP (MQA24) matches the target footprint requirements. Confirm that the operating conditions align with the specified 4.0V to 5.5V supply range. Ensure unused control inputs are tied to defined logic states to prevent floating conditions. Validate thermal management capabilities for the intended ambient temperature environment.
Select this component when a 10-bit bidirectional switch with independent channel control is required. The QSOP package offers a compact form factor suitable for space-constrained layouts. Consider the -2V undershoot tolerance if the application involves signal lines prone to ringing or negative transients. Verify compatibility with the system's logic voltage levels and maximum switching speeds.
This part belongs to the FSTU3384 series of high-speed CMOS bus switches. It shares functional similarities with other devices in the family but is distinguished by its specific QSOP packaging configuration. The series utilizes Fairchild's proven switch technology to deliver low on-resistance and minimal propagation delay characteristics across multiple bit configurations.
Compatible alternatives include the FSTU3384WM in SOIC-24 and the FSTU3384MTC in TSSOP-24 packages. These variants offer identical electrical performance and pinout compatibility. Selection depends primarily on the available board space and preferred mounting style for the specific assembly process.
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