HFA160NJ40C

$29.75

Description：DIODE MOD GP 400V 170A TO244AB
Series：HEXFRED®

SKU:ccd1255737e8 Category: Diode Arrays Brand: Vishay General Semiconductor - Diodes Division

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Product introduction

HFA160NJ40C is listed in the Diode Arrays range at ChipApex. The manufacturer field lists Vishay General Semiconductor - Diodes Division. Its product description is DIODE MOD GP 400V 170A TO244AB. Review the specifications below when checking this part for your BOM.

Diode Arrays specifications for HFA160NJ40C

Description：DIODE MOD GP 400V 170A TO244AB
Series：HEXFRED®
Mfr：Vishay General Semiconductor - Diodes Division
Package：Bulk
Diode Configuration：1 Pair Common Cathode
Technology：Standard
Voltage - DC Reverse (Vr) (Max)：400 V
Current - Average Rectified (Io) (per Diode)：170A (DC)
Voltage - Forward (Vf) (Max) @ If：1.3 V @ 80 A
Speed：Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr)：140 ns
Current - Reverse Leakage @ Vr：6 µA @ 400 V
Operating Temperature - Junction：-
Mounting Type：Chassis Mount
Package / Case：TO-244AB Isolated Tab
Supplier Device Package：TO-244AB (Isolated)
Grade：-
Qualification：-

Diode Arrays datasheet and documents for HFA160NJ40C

HFA160NJ40C

Diode Arrays Overview

The HFA160NJ40C is a HEXFRED ultrafast soft recovery diode module in a TO-244AB package. It features a base common cathode configuration with two anodes. Rated for 400V reverse voltage, it supports 170A continuous forward current at 25°C case temperature and 84A at 100°C. Key electrical parameters include a typical reverse recovery time of 36ns, peak recovery current of 9.3A, and reverse recovery charge of 420nC. The junction-to-case thermal resistance is 0.48 K/W per leg.

Diode Arrays Feature Summary

Ultrafast soft recovery characteristics designed to minimize switching losses and electromagnetic interference in high-frequency power conditioning systems.
Base common cathode dual-diode architecture allowing independent control of two anode terminals within a single insulated module.
Extensive characterization of recovery parameters across varying current, temperature, and di/dt conditions to simplify loss calculations.

Diode Arrays Applications

High-frequency power converters
Motor drives
Applications requiring significant reduction in snubbing components

Diode Arrays Procurement Notes

Verify the specific revision status and manufacturing date code against the latest Vishay General Semiconductor documentation before integration. Confirm that the mounting surface preparation and torque specifications strictly adhere to the datasheet requirements to ensure reliable thermal performance and mechanical integrity during operation.

Diode Arrays Selection Notes

Select this component when system design demands low reverse recovery charge and soft recovery behavior to reduce EMI/RFI. Evaluate thermal management capabilities based on the specified junction-to-case resistance values. Ensure the operating environment remains within the -55°C to +150°C junction temperature range for optimal reliability.

Diode Arrays Part Context

This device belongs to the HEXFRED series from Vishay General Semiconductor, specialized for high-speed rectification. It utilizes silicon technology optimized for reduced RFI and EMI generation. The module format provides robust mechanical stability for stud mounting in industrial power electronics environments.