Single FETs, MOSFETs IGB110S10S1XTMA1 product image

IGB110S10S1XTMA1

$1.91
  • Description:MV GAN DISCRETES
  • Series:CoolGaN™
  • Mfr:Infineon Technologies
  • Package:Tape & Reel (TR),Cut Tape (CT)

SKU:382e69630a3a Category: Brand:

  
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IGB110S10S1XTMA1 is listed in the Single FETs, MOSFETs range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is MV GAN DISCRETES. Review the specifications below when checking this part for your BOM.

Single FETs, MOSFETs specifications for IGB110S10S1XTMA1

  • Description:MV GAN DISCRETES
  • Series:CoolGaN™
  • Mfr:Infineon Technologies
  • Package:Tape & Reel (TR),Cut Tape (CT)
  • FET Type:N-Channel
  • Technology:GaNFET (Gallium Nitride)
  • Drain to Source Voltage (Vdss):100 V
  • Current - Continuous Drain (Id) @ 25°C:9A (Ta), 23A (Tc)
  • Drive Voltage (Max Rds On, Min Rds On):5V
  • Rds On (Max) @ Id, Vgs:11mOhm @ 10A, 5V
  • Vgs(th) (Max) @ Id:2.9V @ 3mA
  • Gate Charge (Qg) (Max) @ Vgs:3.4 nC @ 5 V
  • Vgs (Max):±6.5V
  • Input Capacitance (Ciss) (Max) @ Vds:340 pF @ 50 V
  • FET Feature:-
  • Power Dissipation (Max):2.5W (Ta), 15W (Tc)
  • Operating Temperature:-40°C ~ 150°C (TJ)
  • Grade:-
  • Qualification:-
  • Mounting Type:Surface Mount
  • Supplier Device Package:PG-TSON-4-2
  • Package / Case:4-PowerTDFN

Single FETs, MOSFETs datasheet and documents for IGB110S10S1XTMA1

IGB110S10S1XTMA1

Single FETs, MOSFETs Overview

The IGB110S10S1 is a CoolGaN transistor featuring a 100 V drain-source voltage and a typical on-state resistance of 9.4 mΩ. It supports a continuous drain current of 23 A at 25°C, with a pulsed drain current capability of 210 A. The device exhibits an output charge of 14 nC and a total gate charge of 3.4 nC. It utilizes a PG-TSON-4 package with an exposed die for top-side thermal management.

Single FETs, MOSFETs Feature Summary

  • Ultra-fast switching and high efficiency
  • Space-saving and highly robust package
  • No reverse recovery charge
  • Ultra-low gate charge and output charge
  • Exposed die for top-side thermal excellence

Single FETs, MOSFETs Applications

  • Telecom & datacenter 48V IBC
  • Sync rectification for AC-DC and DC-DC converters
  • Robotics and drones
  • Battery powered tools
  • 48V servo drive

Single FETs, MOSFETs Procurement Notes

Verify the exact ordering code against official Infineon documentation to ensure correct package type and revision level. Confirm industrial grade qualification status and JEDEC compliance requirements prior to integration into final designs.

Single FETs, MOSFETs Selection Notes

Evaluate thermal performance using the specified junction-to-case and junction-to-ambient thermal resistance values. Ensure operating conditions remain within the recommended gate-source voltage limits and do not exceed maximum ratings for optimal lifetime.

Single FETs, MOSFETs Part Context

This component belongs to the CoolGaN G3 series from Infineon Technologies. It is designed for industrial applications and fully qualified according to JEDEC standards. The device integrates advanced GaN technology for improved power density and switching performance.

Single FETs, MOSFETs Replacement Considerations

IGB110S101XTMA1

Single FETs, MOSFETs FAQ

What is the reverse recovery charge (Qrr) value?

The reverse recovery charge is 0 nC.

Is the exposed die intended for electrical connection?

No, the exposed silicon substrate internally connected to the source terminal is not recommended to be used as an electrical connection.

IGB110S10S1XTMA1IGB110S10S1XTMA1
$1.91
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