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IRF740S is listed in the Single FETs, MOSFETs range at ChipApex. The manufacturer field lists Vishay Siliconix. Its product description is MOSFET N-CH 400V 10A D2PAK. Review the specifications below when checking this part for your BOM.
The IRF740S is a third-generation N-channel power MOSFET manufactured by Vishay Siliconix, designed for surface-mount applications in the D2PAK (TO-263) package. It features a drain-source voltage rating of 400 V and a continuous drain current of 10 A at 25 °C case temperature. The device exhibits a maximum on-resistance of 0.55 Ω at VGS = 10 V and a total gate charge of 63 nC. Key electrical characteristics include a threshold voltage range of 2.0 to 4.0 V, an input capacitance of 1400 pF, and a peak diode recovery dv/dt rating of 4.0 V/ns. The component supports repetitive avalanche energy up to 520 mJ and operates within a junction temperature range of -55 °C to +150 °C.
Verify the specific ordering suffix to confirm compliance status, as the datasheet distinguishes between lead-free/halogen-free and leaded terminations. Confirm that the D2PAK (TO-263) package orientation matches the target PCB footprint. Ensure thermal management strategies account for the linear derating factor when operating above 25 °C case temperature. Validate that the selected variant meets all RoHS or REACH regulatory requirements applicable to the final assembly region.
Select this component for applications requiring high voltage blocking capability combined with surface-mount convenience. The D2PAK package offers superior power dissipation compared to standard SMD packages while maintaining lower on-resistance than through-hole alternatives. Consider the 10 A continuous current limit and the need for adequate heatsinking to maintain case temperatures below 100 °C for optimal performance. Evaluate the 0.55 Ω on-resistance against system conduction loss requirements.
The IRF740S belongs to the HEXFET® Power MOSFET family from Vishay Siliconix, representing third-generation technology. This series integrates advanced cell architecture to balance low on-resistance with fast switching speeds. The D2PAK (TO-263) package is specifically engineered to accommodate larger die sizes, providing higher power handling capabilities than smaller surface-mount options. The product line is widely recognized for cost-effectiveness and reliability in industrial power electronics.
IRF740SPbF
The device is rated for a single pulse avalanche energy of 520 mJ and a repetitive avalanche energy of 13 mJ.
The D2PAK (TO-263) package provides low internal connection resistance and a large thermal pad, enabling it to dissipate up to 125 W at 25 °C case temperature.
Yes, the typical reverse recovery time is 370 ns with a maximum of 790 ns under specified test conditions.
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