IS25LP512M-RGLE

Memory IC Overview

The IS25LP512M-RGLE is a NOR flash memory device with a storage capacity of 512 Mbit, organized as 64 M x 8. It operates within a supply voltage range of 2.3 V to 3.6 V and supports synchronous SPI interfaces including QPI and DTR modes at a maximum clock frequency of 133 MHz. The component features an active read current of up to 40 mA and functions reliably across a temperature range of -40°C to +105°C. It is housed in a 24-ball TFBGA package measuring 6x8 mm with a 4x6 ball array.

Memory IC Feature Summary

• Supports high-speed serial peripheral interface operations with quad I/O and QPI modes for efficient data transfer.
• Includes a dedicated reset pin to ensure reliable system initialization and recovery from fault conditions.
• Designed for surface mount technology installation using a compact thin-profile ball grid array package.

Memory IC Applications

• Embedded systems requiring non-volatile code execution storage
• Industrial control units needing wide operating temperature tolerance
• Consumer electronics utilizing compact form factor memory solutions

Memory IC Procurement Notes

Verify the specific suffix RGLE against official ISSI documentation to confirm the 24-ball TFBGA 6x8mm package configuration. Ensure compatibility with existing board layouts regarding the 4x6 ball array pitch. Confirm RoHS compliance status through current manufacturer declarations before finalizing procurement specifications.

Memory IC Selection Notes

Select this component when a 512 Mbit density is required alongside a 24-pin TFBGA footprint. Consider the 133 MHz clock speed and 40 mA active current draw for power budgeting. Verify that the -40°C to +105°C industrial temperature range meets the environmental requirements of the target application platform.

Memory IC Part Context

This part belongs to the IS25LP512M series of NOR flash memories manufactured by ISSI. The series offers various package options including WSON and SOIC variants. The RGLE suffix specifically denotes the TFBGA package type, distinguishing it from other physical form factors within the same electrical specification family.

Memory IC Replacement Considerations

IS25LP512M-RHLE serves as a substitute option featuring a similar 24-ball TFBGA package but utilizes a 5x5 ball array instead of the 4x6 array found in the RGLE variant. Pinout compatibility must be verified carefully due to the different ball arrangement geometry.