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ISP827XBSM is listed in the Transistor, Photovoltaic Output Optoisolators range at ChipApex. The manufacturer field lists Isocom Components 2004 LTD. Its product description is OPTOISOLATOR 5KV 2CH TRANS 8-DIP. Review the specifications below when checking this part for your BOM.
The ISP827XBSM is a dual-channel transistor output optocoupler manufactured by Isocom Components. It features a plastic DIP-8 package and provides 5300Vrms isolation voltage between input and output circuits. The device operates within a temperature range of -55°C to 100°C. Key electrical parameters include a minimum collector-emitter breakdown voltage of 35V, a maximum forward current of 50mA, and a typical nominal current transfer ratio of 200%. The component is RoHS compliant and UL recognized under file number E91231.
Verify the specific suffix 'BSM' against official Isocom documentation to confirm lead form and packaging specifications. Ensure compatibility with existing PCB footprints for DIP-8 packages. Confirm that the 5300Vrms isolation rating meets the safety requirements of the target application environment. Check for RoHS compliance status if restricted substances are a concern.
Select this component when dual-channel isolation is required within a compact footprint. The 5300Vrms rating suits applications demanding high dielectric strength. Consider the 200% CTR for driving subsequent logic stages. Verify thermal management needs given the 100°C maximum operating temperature limit. Compare against single-channel alternatives if only one isolated path is necessary.
This part belongs to the ISP827X series of high-density phototransistor optocouplers. The series offers multiple lead form options including STD and G forms. It shares core characteristics with other members like ISP817X and ISP847X but differs in channel count and pinout configuration. The X suffix typically denotes specific approval or lead form variations within the family.
Direct substitutes may include other dual-channel optocouplers with similar 5300Vrms isolation and DIP-8 packaging. Verify pin-to-pin compatibility before substitution. Ensure replacement parts meet the same UL and VDE certification requirements. Check that the replacement's current transfer ratio and switching speeds align with circuit design specifications.
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