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M2S150TS-1FCG1152 is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is IC SOC CORTEX-M3 166MHZ 1152BGA. Review the specifications below when checking this part for your BOM.
The M2S150TS-1FCG1152 is a SmartFusion 2 System-on-Chip FPGA manufactured by Microchip Technology. It integrates an ARM Cortex-M3 processor core operating at a maximum frequency of 166 MHz with 512 kB of program memory and 64 kB of data RAM. The device features 146,124 logic elements organized into 12,177 Logic Array Blocks (LAB). It utilizes an FCBGA-1152 package for surface-mount installation. The component supports commercial temperature operation ranging from 0°C to 85°C.
Verify export compliance requirements as this product may require additional documentation for shipment from the United States. Confirm that the specific ordering suffix matches the required temperature grade and package variant. Ensure that power supply voltages adhere strictly to the recommended operating conditions specified in the datasheet to maintain device reliability.
Select this model when an integrated MCU and FPGA fabric are required on a single chip. The 'TS' designation indicates Data Security density, while '1' specifies the commercial temperature grade. Verify that the 1152-ball FCBGA footprint fits the target PCB layout. Consider thermal resistance values when designing heat dissipation strategies for high-density logic applications.
This component belongs to the SmartFusion 2 family, which combines FlashFPGA technology with a hard ARM Cortex-M3 core. It is distinct from the IGLOO 2 family, which lacks the integrated microcontroller subsystem. The M2S150TS variant offers higher security features compared to standard density parts, making it suitable for applications requiring robust data protection.
Parametric equivalents include M2S150T-1FC1152M and M2S150-1FCG1152. Verify pin compatibility and software migration requirements before substitution. Different suffixes may indicate variations in temperature range or packaging that affect mechanical fit and environmental performance.
The integrated ARM Cortex-M3 core operates at a maximum clock frequency of 166 MHz.
Yes, the device integrates high-performance SerDes lanes capable of supporting up to four PCI Express Gen 2 endpoints.
The device contains 146,124 logic elements arranged in 12,177 Logic Array Blocks (LAB).
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