MSCDC600A170AG

$1,120.39

Description：DIODE MODULE SIC 1700V 600A SP6C
Series：-

SKU:98affd7e75e7 Category: Diode Arrays Brand: Microchip Technology

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Product introduction

MSCDC600A170AG is listed in the Diode Arrays range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is DIODE MODULE SIC 1700V 600A SP6C. Review the specifications below when checking this part for your BOM.

Diode Arrays specifications for MSCDC600A170AG

Description：DIODE MODULE SIC 1700V 600A SP6C
Series：-
Mfr：Microchip Technology
Package：Tube
Diode Configuration：1 Pair Series Connection
Technology：SiC (Silicon Carbide) Schottky
Voltage - DC Reverse (Vr) (Max)：1700 V
Current - Average Rectified (Io) (per Diode)：600A
Voltage - Forward (Vf) (Max) @ If：1.8 V @ 600 A
Speed：No Recovery Time > 500mA (Io)
Reverse Recovery Time (trr)：0 ns
Current - Reverse Leakage @ Vr：2.4 mA @ 1700 V
Operating Temperature - Junction：-40°C ~ 175°C
Mounting Type：Chassis Mount
Package / Case：Module
Supplier Device Package：SP6C
Grade：-
Qualification：-

Diode Arrays datasheet and documents for MSCDC600A170AG

MSCDC600A170AG

Diode Arrays Overview

The MSCDC600A170AG is a silicon carbide Schottky diode module manufactured by Microchip Technology. It features a Phase Leg configuration within the SP6C package, designed for screw mount installation. The device supports a maximum repetitive reverse voltage of 1.7 kV and a continuous forward current of 600 A. Its forward voltage is specified at 1.5 V. The module operates reliably within a temperature range from -40°C to +125°C.

Diode Arrays Feature Summary

Utilizes silicon carbide technology for high-efficiency power conversion
Features a phase leg topology suitable for bridge rectifier applications
Designed with a robust screw mount SP6C package for secure integration

Diode Arrays Applications

Industrial motor drives
Uninterruptible power supplies
High-frequency inverters

Diode Arrays Procurement Notes

Verify the specific suffix AG against official Microchip documentation to confirm exact manufacturing lot characteristics and compliance status. Ensure that the SP6C mechanical dimensions match the target heatsink interface requirements before finalizing procurement orders. Cross-reference the datasheet revision date to guarantee alignment with current design specifications.

Diode Arrays Selection Notes

Select this component when designing systems requiring high current handling capabilities combined with elevated blocking voltages. The silicon carbide material offers superior thermal performance compared to traditional silicon alternatives. Consider the 600 A rating and 1.7 kV breakdown strength to ensure adequate safety margins for the intended electrical load conditions.

Diode Arrays Part Context

This module belongs to Microchip's series of silicon carbide Schottky diode modules. These components are engineered to replace conventional silicon devices in high-power applications. The SP6C packaging provides a standardized form factor for easy mounting on cold plates or heatsinks within larger power electronic assemblies.