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PMEG3010BEA/ZLF is listed in the Single Diodes range at ChipApex. The manufacturer field lists NXP USA Inc.. Its product description is DIODE SCHOTTKY SOD323. Review the specifications below when checking this part for your BOM.
The PMEG3010BEA/ZLF is a planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier manufactured by NXP Semiconductors. It features an integrated guard ring for stress protection and is encapsulated in a SOD-128 small and flat lead Surface-Mounted Device plastic package. The device supports an average forward current of 1 A and a reverse voltage of 30 V. Key electrical parameters include a maximum forward voltage drop of 360 mV and a peak non-repetitive forward surge current of 50 A.
Verify the specific suffix configuration against official datasheets to confirm package type and automotive qualification status. Ensure compatibility with reflow and wave soldering processes as specified in the manufacturing guidelines. Cross-reference part numbers with Nexperia or NXP distributors to validate authenticity and supply chain integrity before procurement.
Select this component for applications requiring low forward voltage drops and robust reverse blocking capabilities in a compact surface-mount form factor. The SOD-128 package is suitable for space-constrained designs. Consider the 1 A current rating and 30 V reverse voltage limits when designing power stages. Verify thermal management requirements based on the expected operating conditions and duty cycle.
This device belongs to the PMEG series of MEGA Schottky barrier rectifiers, which are engineered for general-purpose applications requiring high efficiency. The series utilizes advanced planar technology to minimize forward voltage while maintaining reliability. These components are widely used in consumer electronics and industrial power supplies where size and performance are critical design constraints.
Check for equivalent parts such as PMEG3010EP-Q from Nexperia, which shares similar specifications and automotive qualification. Ensure pinout compatibility and package dimensions match the existing PCB layout when substituting components.
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