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SDR1030-331K is listed in the Fixed Inductors range at ChipApex. The manufacturer field lists Bourns Inc.. Its product description is FIXED IND 330UH 380MA 1.7OHM SMD. Review the specifications below when checking this part for your BOM.
The Bourns SDR1030-331K is a surface-mount fixed inductor from the SDR1030 series, designed for power delivery applications. It features a nominal inductance of 330 µH with a tolerance of ±10%. The component has a DC resistance of 1.7 Ohms and a saturation current rating of 0.40 A. It utilizes a shielded core construction to minimize electromagnetic interference. The device is packaged in a standard 1030 footprint, suitable for automated assembly processes in compact electronic designs.
Verify the specific ordering suffix against the manufacturer's official datasheet to ensure correct tolerance and packaging specifications. Confirm that the requested quantity aligns with standard reel sizes or cut tape options provided by authorized distributors. Cross-reference the date code and lot number upon receipt to ensure compliance with project requirements and traceability standards.
Select this component based on the required inductance value of 330 µH and the maximum operating current of 0.40 A. Ensure the PCB layout accommodates the 1030 package dimensions and thermal dissipation needs. Evaluate the DC resistance impact on overall efficiency within the target circuit topology before finalizing the design integration.
This part belongs to the SDR1030 series of nonstandard fixed inductors manufactured by Bourns Inc. The series offers various inductance values tailored for different power management requirements. These components are engineered for reliability in demanding electronic environments, providing consistent performance across temperature variations typical in industrial and consumer electronics.
Consult the official Bourns cross-reference documentation for verified substitute part numbers. Ensure any alternative component matches the 330 µH inductance, 0.40 A current rating, and 1030 package footprint. Verify compatibility with existing PCB layouts and thermal constraints before implementing any substitution.
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