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SN74LV21ADBR is listed in the Inverter Gates range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC GATE AND 2CH 4-INP 14SSOP. Review the specifications below when checking this part for your BOM.
The SN74LV21ADBR is a dual 4-input positive-AND gate from Texas Instruments, part of the LV series. It operates within a supply voltage range of 2 V to 5.5 V. The device features a 14-pin SSOP package and supports surface-mount installation. It provides two independent logic gates, each with four inputs. The component is designed for low-voltage digital applications requiring reliable Boolean AND functionality.
Verify the exact suffix 'DBR' confirms the SSOP-14 package and tape-and-reel packaging format. Ensure the revision level matches project requirements. Confirm RoHS compliance status through official documentation. Validate that the operating temperature range meets environmental specifications. Check for any specific handling instructions related to electrostatic discharge sensitivity.
Select this component when dual 4-input AND functionality is required in low-voltage environments. The LV series offers improved performance over older standards while maintaining compatibility. Consider the SSOP package size for space-constrained PCB layouts. Verify input voltage thresholds align with the driving source logic levels. Ensure the output drive capability meets the load requirements of the connected circuits.
This device belongs to the SN74LVxxA family of advanced low-voltage CMOS logic devices. The family is characterized by high speed and low power consumption. The SN74LV21A specifically implements the AND logic function. It is widely used in consumer electronics and industrial control systems where low voltage operation is essential.
Check for SN74LV21APWR as an alternative pin-compatible option in a different package. Verify functional equivalence with other manufacturers' LV21 variants. Ensure electrical parameters such as propagation delay and output current are compatible. Confirm package dimensions match existing footprints if physical replacement is necessary.
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