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THS4022CDGN is listed in the Instrumentation, Op Amps, Buffer Amps range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC OPAMP VFB 2 CIRCUIT 8HVSSOP. Review the specifications below when checking this part for your BOM.
The THS4022CDGN is a dual high-speed voltage-feedback operational amplifier manufactured by Texas Instruments. It features a gain-bandwidth product of 350 MHz and a slew rate of 470 V/us. The device operates within a supply voltage range of 9 V to 32 V, drawing 7.8 mA per channel. Key electrical specifications include a common-mode rejection ratio of 95 dB, an input bias current of 6 uA, and an input offset voltage of 500 uV. Each channel provides an output current capability of 100 mA with an input voltage noise density of 1.5 nV/sqrt Hz. The component is housed in an 8-MSOP PowerPAD package.
Verify the specific suffix against official Texas Instruments documentation to confirm package type and temperature rating. Ensure the ordering part number matches the required thermal pad configuration and lead finish. Cross-reference the manufacturer datasheet revision history to validate current production status and any recent parameter updates before finalizing procurement.
Select this component when dual-channel operation with low noise and high speed is required. Compare the 350 MHz bandwidth and 470 V/us slew rate against system signal requirements. Evaluate the 8-MSOP PowerPAD package for thermal management needs relative to available PCB space. Confirm that the 9 V minimum supply voltage aligns with the target power budget.
This device belongs to the THS4022 series of high-speed operational amplifiers from Texas Instruments. It is designed for applications demanding both wide bandwidth and low distortion. The series includes variants such as the THS4022ID and THS4022CDGNG4, offering different package options like SOIC-8 and MSOP-PowerPAD to suit various layout constraints.
Publicly confirmed substitute part numbers are not available in the provided source material. Verify compatibility with alternative devices by matching critical parameters such as gain-bandwidth product, slew rate, and package dimensions against the original design specifications.
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