UFS128-CY14-02J01

Memory IC Overview

The Kingston UFS128-CY14-02J01 is a Universal Flash Storage device compliant with the JEDEC UFS 3.1 standard, integrating 3D NAND flash and a controller within an FBGA153 package. It features a total density of 128GB, with 128,026,935,296 bytes allocated to user capacity. The device supports high-speed data transfer up to HS-GEAR4 on a two-lane bus at a 26MHz clock frequency. Sequential read performance reaches 1650 MB/s, while sequential write performance achieves 950 MB/s under dynamic SLC conditions. Operating voltages are specified as VCC between 2.4V and 2.7V (typical 2.5V) and VCCQ between 1.14V and 1.26V (typical 1.2V).

Memory IC Feature Summary

• Supports High Speed Gear Rates up to HS-GEAR4 for enhanced data throughput.
• Includes internal error correction code and enhanced data management algorithms for reliable memory access.
• Features multiple power modes including Active, Idle, Sleep, and PowerDown for optimized energy efficiency.
• Provides hardware security capabilities such as Replay Protected Memory Block and secure bad block erase commands.

Memory IC Applications

• Smartphones requiring mass storage solutions.
• Tablets and electronic toys.
• Automotive sensors and artificial intelligence robotics.
• Virtual reality headsets and unmanned aerial vehicles.

Memory IC Procurement Notes

Verify that the specific part number matches the required 128GB density and FBGA153 package dimensions. Confirm compatibility with host systems supporting the UFS 3.1 specification and appropriate voltage levels. Ensure environmental operating ranges align with application requirements. Contact manufacturer representatives for detailed RoHS declarations or specific test condition performance data not covered in the general datasheet.

Memory IC Selection Notes

Select this component when a compact, high-performance embedded storage solution is needed for mobile or IoT devices. The UFS 3.1 interface offers superior speed compared to eMMC alternatives. Consider the thermal and power constraints of the target system, as the device supports various low-power states. Verify that the host SoC can support the required reference clock frequencies and differential signaling for HS-BURST modes.

Memory IC Part Context

This model belongs to Kingston's UFS product line designed for embedded applications. It shares the same FBGA153 package and interface protocol with the 64GB and 256GB variants in the series. The primary distinction lies in the NAND density and resulting sequential performance metrics. All models in this family adhere to the same mechanical and electrical specifications defined by the UFS 3.1 standard.

Memory IC Replacement Considerations

Direct replacements include the UFS64G-CY14-02J01 and UFS256-CY14-02J01 from the same Kingston series, provided capacity differences are acceptable. Ensure any substitute maintains the FBGA153 footprint and UFS 3.1 compliance. Verify that the replacement part supports the same voltage ranges and temperature specifications.