XCVM1802-1MSEVSVD1760

Soc System On Chip Overview

The AMD XCVM1802-1MSEVSVD1760 is a Versal Prime Series adaptive SoC FPGA in a 1760-pin FCBGA package. It integrates dual-core ARM Cortex-A72 and dual-core ARM Cortex-R5F processors with programmable logic. The device operates at a core voltage of 800 mV within a commercial temperature range of 0°C to 100°C junction temperature.

Soc System On Chip Feature Summary

• Versal Prime Series architecture combining software-programmable silicon infrastructure with compute engines
• Integrated DDR memory controllers for high-bandwidth data access
• Programmable Network-on-Chip (NoC) for flexible system interconnectivity

Soc System On Chip Applications

• Data center network acceleration
• SmartNIC implementations
• 5G xHaul networking

Soc System On Chip Procurement Notes

Verify the specific speed grade suffix against official AMD documentation, as variants exist within the same package family. Confirm RoHS compliance status and moisture sensitivity level requirements prior to integration into manufacturing workflows.

Soc System On Chip Selection Notes

Select this model for applications requiring mid-range Versal Prime performance with a 1760-pin footprint. Ensure design constraints align with the 800 mV core voltage requirement and verify that the available I/O count meets interface specifications.

Soc System On Chip Part Context

This component belongs to the AMD Versal Prime series, designed for connectivity and inline acceleration workloads. It serves as an alternative to higher-end AI Edge models by focusing on deterministic processing and standard I/O capabilities for enterprise infrastructure.

Soc System On Chip Replacement Considerations

The XCVM1802-2MSEVSVD1760 shares the same package and pinout but offers a different speed grade. Verify timing closure feasibility before substituting between speed grades.