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— IC芯片 | 连接器 | 传感器 | 被动器件 —

Devices in the System-on-Chip family combine on one device substrate several computing system components which traditionally would be implemented as separate devices, such as a general-purpose microprocessor, an FPGA co-processor, and a graphics controller for generation of display data. While limited amounts of data storage resources may also be incorporated, the provision of an interface to external storage devices is typical.
| Select products | Mfr | Description | Package | Supplier Device Package | Mounting Type | Series | Operating Temperature |
|---|---|---|---|---|---|---|---|
![]() XCZU46DR-1FSVH1760E $18,666.00 | AMD | IC ZUP RFSOC A53 FPGA 1760BGA | Tray | 1760-FCBGA (42.5x42.5) | Zynq® UltraScale+™ RFSoC | 0°C ~ 100°C (TJ) | |
![]() XCZU46DR-1FSVH1760I $23,332.50 | AMD | IC ZUP RFSOC A53 FPGA 1760BGA | Tray | 1760-FCBGA (42.5x42.5) | Zynq® UltraScale+™ RFSoC | -40°C ~ 100°C (TJ) | |
![]() XCZU46DR-2FFVH1760E $26,132.19 | AMD | IC ZUP RFSOC A53 FPGA 1760BGA | Tray | 1760-FCBGA (42.5x42.5) | Zynq® UltraScale+™ RFSoC | 0°C ~ 100°C (TJ) | |
![]() XCZU46DR-2FFVH1760I $29,865.81 | AMD | IC ZUP RFSOC A53 FPGA 1760BGA | Tray | 1760-FCBGA (42.5x42.5) | Zynq® UltraScale+™ RFSoC | -40°C ~ 100°C (TJ) | |
![]() XCZU46DR-2FSVH1760E $26,132.19 | AMD | IC ZUP RFSOC A53 FPGA 1760BGA | Tray | 1760-FCBGA (42.5x42.5) | Zynq® UltraScale+™ RFSoC | 0°C ~ 100°C (TJ) | |
![]() XCZU46DR-2FSVH1760I $29,865.81 | AMD | IC ZUP RFSOC A53 FPGA 1760BGA | Tray | 1760-FCBGA (42.5x42.5) | Zynq® UltraScale+™ RFSoC | -40°C ~ 100°C (TJ) | |
![]() XCZU46DR-L1FFVH1760I $26,132.19 | AMD | IC ZUP RFSOC A53 FPGA LP 1760BGA | Tray | 1760-FCBGA (42.5x42.5) | Zynq® UltraScale+™ RFSoC | -40°C ~ 100°C (TJ) | |
![]() XCZU46DR-L1FSVH1760I $26,132.19 | AMD | IC ZUP RFSOC A53 FPGA LP 1760BGA | Tray | 1760-FCBGA (42.5x42.5) | Zynq® UltraScale+™ RFSoC | -40°C ~ 100°C (TJ) |