SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —

A capacitor is a passive electronic device that stores electric charge. Tantalum capacitors have an anode electrode (+) made of tantalum metal, electrolyte that acts as the cathode, and a thin insulating layer of tantalum oxide that acts as the dielectric. Tantalum capacitors have high capacitance-voltage (CV) product per unit volume at low weights and are known for high reliability.
| Select products | Mfr | Description | Package | Supplier Device Package | Mounting Type | Series | Operating Temperature |
|---|---|---|---|---|---|---|---|
![]() 173D474X0050VWE3 $0.91 | Vishay Sprague | CAP TANT 0.47UF 20% 50V AXIAL | Tape & Reel (TR) | Through Hole | TANTALEX™, 173D | -55°C ~ 125°C | |
![]() 173D474X5035U $1.02 | Vishay Sprague | CAP TANT 0.47UF 5% 35V AXIAL | Tape & Box (TB) | Through Hole | TANTALEX™, 173D | -55°C ~ 125°C | |
![]() 173D474X5035UE3 $1.02 | Vishay Sprague | CAP TANT 0.47UF 5% 35V AXIAL | Tape & Box (TB) | Through Hole | TANTALEX™, 173D | -55°C ~ 125°C | |
![]() 173D474X5050V $1.45 | Vishay Sprague | CAP TANT 0.47UF 5% 50V AXIAL | Tape & Box (TB) | Through Hole | TANTALEX™, 173D | -55°C ~ 125°C | |
![]() 173D474X5050VE3 $1.45 | Vishay Sprague | CAP TANT 0.47UF 5% 50V AXIAL | Tape & Box (TB) | Through Hole | TANTALEX™, 173D | -55°C ~ 125°C | |
![]() 173D474X9025U $0.73 | Vishay Sprague | CAP TANT 0.47UF 10% 25V AXIAL | Tape & Box (TB) | Through Hole | TANTALEX™, 173D | -55°C ~ 125°C | |
![]() 173D474X9025UE3 $0.73 | Vishay Sprague | CAP TANT 0.47UF 10% 25V AXIAL | Tape & Box (TB) | Through Hole | TANTALEX™, 173D | -55°C ~ 125°C | |
![]() 173D474X9025UW $0.65 | Vishay Sprague | CAP TANT 0.47UF 10% 25V AXIAL | Tape & Reel (TR) | Through Hole | TANTALEX™, 173D | -55°C ~ 125°C |
TM8R106K010ESBView Product
T494C335K025ATView Product
790D224X0040A2HE3View Product
T499B685K016ATE3K5View Product
TM8M475M010UZAView Product
CWR09FB225MBView Product
TBJE477K006LRLC0045View Product
TAZB335K015CBSB0800View Product
T491B105M035ZT7111View Product
TPSD686M020R0200View Product
T495X476K020AHE065View Product
TBJB475K025LBSB0023View Product
The multilayer ceramic capacitor (MLCC) market has fallen into a severe structural supply crunch in the third quarter of 2026, driven by explosive demand…
Read More
As the backbone of modern technology, electronic components are undergoing revolutionary changes, driven by advancements in materials science, miniaturization, and smart manufacturing. From ultra-efficient…
Read More
Compare thermistors, RTDs, thermocouples and temperature ICs. Learn how range, accuracy, response, interfaces and mounting affect component selection.
Read More
Understand how a comparator switches at a voltage threshold, why hysteresis prevents chatter, and which output and input specs matter.
Read MoreSeptember 16, 2026 – Global — Leading semiconductor manufacturer ON Semiconductor (onsemi, NASDAQ: ON) has officially issued a formal price adjustment letter to global…
Read More
Manchester, New Hampshire, USA – March 22, 2026 – Allegro MicroSystems, Inc. (Nasdaq: ALGM), a global leader in high-performance power and sensing semiconductor solutions…
Read More
Every audio power amplifier design starts with the same fundamental challenge: converting a low-voltage line-level signal into the high-current drive required by a reactive…
Read More
Compare RC, crystal and MEMS oscillator circuits. Check ppm, jitter, load capacitance, startup margin and output compatibility before choosing a clock source.
Read More
Tokyo / Munich / Tessenderlo, December 24, 2025As the global semiconductor industry enters the first year of the 2nm process era, international electronic component…
Read More
Date: May 13, 2026 The global memory industry is facing an unprecedented supply crunch in legacy MLC NAND Flash. Leading manufacturers including Samsung Electronics…
Read MoreMay 4, 2026 — The global power semiconductor market is grappling with a worsening supply crunch, as lead times for key components have extended…
Read MoreTOKYO, July 31, 2026 — Renesas Electronics Corporation has officially announced a major domestic manufacturing restructuring, confirming plans to gradually discontinue all wafer fabrication…
Read More