SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
Discrete semiconductor products include individual transistors, diodes, and thyristors, as well as small arrays of such composed of two, three, four, or some other small number of similar devices within a single package. The most common and widely known is the MOSFET (metal-oxide-semiconductor field-effect transistor). They are commonly used for constructing circuits with considerable voltage or current stress, or for realizing very basic circuit functions.
| Select products | Mfr | Description | Package | Supplier Device Package | Mounting Type | Series | Operating Temperature |
|---|---|---|---|---|---|---|---|
![]() 1N4713 BK TIN/LEAD $0.20 | Central Semiconductor Corp | 30V 500MW TH DIODE-ZENER SINGLE: | Box | Through Hole | - | -65°C ~ 200°C (TJ) | |
![]() 1N4713 TR PBFREE $0.17 | Central Semiconductor Corp | DIODE ZENER 30V 500MW DO35 | Tape & Reel (TR) | Through Hole | - | -65°C ~ 200°C (TJ) | |
![]() 1N4713 TR TIN/LEAD $0.19 | Central Semiconductor Corp | 30V 500MW TH DIODE-ZENER SINGLE: | Tape & Reel (TR) | Through Hole | - | -65°C ~ 200°C (TJ) | |
| MCC (Micro Commercial Components) | DIODE ZENER 30V 500MW DO35 | Tape & Reel (TR) | Through Hole | - | 200°C (TJ) | ||
![]() 1N4713/TR $3.03 | Microchip Technology | DIODE ZENER 30V 500MW DO7 | Tape & Reel (TR) | Through Hole | - | -65°C ~ 175°C (TJ) | |
![]() 1N4713D $7.23 | Microchip Technology | DIODE ZENER 30V 500MW DO7 | Bulk | Through Hole | - | -65°C ~ 175°C | |
![]() 1N4713UR-1 $3.75 | Microchip Technology | DIODE ZENER 30V 500MW DO213AA | Bulk | Surface Mount | - | -65°C ~ 175°C (TJ) | |
![]() 1N4713UR-1/TR $4.16 | Microchip Technology | DIODE ZENER 30V 500MW DO213AA | Tape & Reel (TR),Cut Tape (CT) | Surface Mount | - | -65°C ~ 175°C (TJ) |

Recently, the global electronic component market has witnessed complex and changeable trends. In the memory chip sector, the wave of price increases continues to…
Read More
Choose logic inverter ICs by thresholds, supply, output drive and delay. Compare standard and Schmitt-trigger inputs, power sequencing and replacement checks.
Read More
Tempe, Arizona‑based semiconductor giant Microchip Technology has formally rolled out selective product price increases across its MCU, power‑management IC, memory controller and analog component…
Read More
Hsinchu, Taiwan – April 18, 2026 – United Microelectronics Corporation (UMC, NYSE: UMC), a leading global semiconductor foundry specializing in mature process technologies, has…
Read More
Compare thermistors, RTDs, thermocouples and temperature ICs. Learn how range, accuracy, response, interfaces and mounting affect component selection.
Read More
Munich, Germany – May 26, 2026 – Power semiconductor and automotive chip giant Infineon Technologies AG has formally notified customers worldwide of a second…
Read More
Recently, the global electronic components market has been constantly evolving, and different regions and enterprises have witnessed new moves in aspects such as technological…
Read More
[Shenzhen/Shanghai/Beijing, January 2025] — As global digital transformation accelerates, the electronic components industry has reached a critical inflection point in 2025. Emerging fields such…
Read More
Over the past week, the global electronic components sector has witnessed dual transformations in policy and technology: Coupled with mounting pressure from a worsening…
Read More
PLANO, Texas – March 20, 2026 – Diodes Incorporated (Nasdaq: DIOD), a leading global manufacturer and supplier of high-quality application-specific standard products in the…
Read More
Understand how a comparator switches at a voltage threshold, why hysteresis prevents chatter, and which output and input specs matter.
Read More
What Is NAND Flash? A Practical Guide for Engineers & Procurement Teams In today’s data-driven world—from smartphones and SSDs to industrial IoT devices—NAND flash…
Read More