SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —

Products in this family are interconnect products used in conjunction with Flat Flexible Cable (FFC) and Flexible Printed Circuit (FPC) materials and are predominantly of the sort which perform a cable-to-board interconnect function, being mounted to a printed circuit board, and providing both electrical connection and mechanical retention for an inserted FFC or FPC cable.
| Select products | Mfr | Description | Package | Supplier Device Package | Mounting Type | Series | Operating Temperature |
|---|---|---|---|---|---|---|---|
| Molex | 1.25 FFC ZIF HSG ASSY 17CKT | Bulk | - | * | - | ||
![]() 39532184 $1.31 | Molex | CONN FFC FPC TOP 18POS 1.25MM RA | Tray | Through Hole, Right Angle | 5597 | -20°C ~ 80°C | |
![]() 39532185 $1.31 | Molex | CONN FFC VERT 18POS 1.25MM PCB | Tray | Through Hole | 5597 | -20°C ~ 80°C | |
![]() 39532194 $3.30 | Molex | CONN FFC FPC TOP 19POS 1.25MM RA | Tray | Through Hole, Right Angle | 5597 | -20°C ~ 80°C | |
![]() 39532195 $0.89 | Molex | CONN FFC VERT 19POS 1.25MM PCB | Tray | Through Hole | 5597 | -20°C ~ 80°C | |
![]() 39532204 $1.76 | Molex | CONN FFC FPC TOP 20POS 1.25MM RA | Tray | Through Hole, Right Angle | 5597 | -20°C ~ 80°C | |
![]() 39532205 $1.63 | Molex | CONN FFC VERT 20POS 1.25MM PCB | Tray | Through Hole | 5597 | -20°C ~ 80°C | |
![]() 39532214 $3.56 | Molex | CONN FFC FPC TOP 21POS 1.25MM RA | Tray | Through Hole, Right Angle | 5597 | -20°C ~ 80°C |

Understand tactile switches, PCB and keyboard differences, four-pin wiring, debounce, force, travel and replacement checks for reliable control inputs.
Read MoreMay 8, 2026 – Eindhoven, Netherlands NXP Semiconductors (NXPI), a global leader in automotive and industrial semiconductor solutions, has officially notified its worldwide channel…
Read More
Learn the relay definition, coil and contact operation, NO and NC forms, load ratings and suppression choices. Compare mechanical, reed and solid-state types.
Read More
TOKYO, April 1, 2026 – Kioxia Corporation (formerly Toshiba Memory Corporation), a global leader in flash memory and storage solutions, has officially issued a…
Read More
Select power transformers by input frequency, secondary VA, rectifier load, isolation, regulation and inrush. Build a clearer specification for your next RFQ.
Read More
On September 22nd, it was reported that Samsung Electronics, the South Korean tech giant, had successfully passed NVIDIA’s certification test for its 12-layer HBM3E…
Read More
In the vast landscape of memory technology, EEPROM (Electrically Erasable Programmable Read-Only Memory) often plays the unsung hero. While NAND Flash grabs headlines for…
Read MoreLatest updates from leading semiconductor manufacturers: Wolfspeed launches new SiC modules, AMD reveals MI430X with HBM4, TSMC eyes third Japan fab, and Samsung samples…
Read More
See how a MEMS gyroscope measures angular rate, why its angle estimate drifts, and which range, noise, interface and temperature specs to compare.
Read More
Explore electronic component types, functions, packages and datasheets. Learn selection, replacement and BOM checks before ordering parts for your PCB.
Read More
Select a bridge rectifier by reverse voltage, capacitor charging current, startup surge and cooling. Work through a stated DC voltage and ripple example.
Read More
Samsung Electronics, the world’s largest memory chip manufacturer, has officially confirmed the end-of-life (EOL) for its LPDDR4 and LPDDR4X low-power DRAM products, marking a…
Read More