SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —

Fiber optic transceiver modules are fiber cable adaptive housings that contain a light source for transmitting data via fiber optic cable as well as a photodiode for receiving fiber optic data. Mounting options include pluggable CXP, QSFP, SFF, SFP, and XFP, surface or through-hole, CFP, 1x9 SC, and panel. Data rate, wavelength, application and connector type are among the primary selection parameters.
| Select products | Mfr | Description | Package | Supplier Device Package | Mounting Type | Series | Operating Temperature |
|---|---|---|---|---|---|---|---|
![]() B-730-0006-034-C $492.30 | ATGBICS | Compatible SFP 1000Mb | Tray | Pluggable, SFP | Ciena® Compatible | ||
![]() B-730-0006-034-I-C $492.30 | ATGBICS | Compatible SFP 1000Mb | Tray | Pluggable, SFP | Ciena® Compatible | ||
![]() B-730-0006-035-I-C $492.30 | ATGBICS | Compatible SFP 1000Mb | Tray | Pluggable, SFP | Ciena® Compatible | ||
![]() B-730-0006-036-C $562.50 | Amphenol ProLabs | Ciena B-730-0006-036 Compatible | Retail Package | Pluggable, SFP | - | ||
![]() B-730-0006-036-C $492.30 | ATGBICS | Compatible SFP 1000Mb | Tray | Pluggable, SFP | Ciena® Compatible | ||
![]() B-730-0006-036-I-C $492.30 | ATGBICS | Compatible SFP 1000Mb | Tray | Pluggable, SFP | Ciena® Compatible | ||
![]() B-730-0006-037-C $562.50 | Amphenol ProLabs | Ciena B-730-0006-037 Compatible | Retail Package | Pluggable, SFP | - | ||
![]() B-730-0006-037-C $492.30 | ATGBICS | Compatible SFP 1000Mb | Tray | Pluggable, SFP | Ciena® Compatible |
M-SFP-LX+/LC-EEC-CView Product
F5-UPG-SFP28-SR-CView Product
FTLC1155RGPLCView Product
XFP-10GB-DW48-100-CView Product
GP-QSFP-40GE-ESR4-CView Product
TQS-Q1LH9-PCAView Product
OPT_ZR-DW4214-CView Product
SFF2X5-155B-85VC-2K-M-LC-ATView Product
332-1368-HPCView Product
1061701887-01-CView Product
1442140G-BX35-CView Product
FTLF8524E2GNV-6CView Product
Embedded Integrated Circuit Modules: The Backbone of Modern Technology Embedded Integrated Circuit Modules (EICMs) have become an indispensable part of modern technology. Serving as…
Read More
On September 22nd, it was reported that Samsung Electronics, the South Korean tech giant, had successfully passed NVIDIA’s certification test for its 12-layer HBM3E…
Read More
In the embedded world, general-purpose CPUs are great at running operating systems, and MCUs excel at logic control. But when you need to process…
Read More
Samsung Electronics, the world’s largest memory chip manufacturer, has officially confirmed the end-of-life (EOL) for its LPDDR4 and LPDDR4X low-power DRAM products, marking a…
Read More
Recently, a survey by the Electronic Components Industry Association (ECIA) revealed that the sales sentiment of global electronic components remained optimistic in the third…
Read More
In an era dominated by AI accelerators with terabytes of HBM memory and consumer devices racing toward LPDDR5X bandwidth, it’s easy to wonder: why…
Read More
Recently, the global electronic component market has witnessed complex and changeable trends. In the memory chip sector, the wave of price increases continues to…
Read More
Select MOV varistors by continuous voltage, clamping behavior, surge waveform and repetition. Check thermal disconnection, fuse coordination and replacements.
Read More
STMicroelectronics (ST), a global leader in semiconductor manufacturing, has officially notified customers of a new round of price increases for selected products, set to…
Read More
Understand thermal fuse operation, Tf, Th and Tm, electrical ratings and mounting. Check temperature limits and replacement requirements for your design.
Read More
On October 1, 2025 local time, OpenAI, an artificial intelligence research company, announced the establishment of a cooperative relationship with Samsung Electronics and SK…
Read More
Every audio power amplifier design starts with the same fundamental challenge: converting a low-voltage line-level signal into the high-current drive required by a reactive…
Read More