SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —

Memory is a semiconductor device that is used as data storage device on an integrated circuit. These devices are available in several formats CBRAM, DRAM, EEPROM, EERAM, EPROM, Flash, FRAM, NVSRAM, PCM (PRAM), PSRAM, RAM, and SRAM in either Non-Volatile or Volatile. Memory sizes range from 64 b to 6 Tb with the interface being I2C, MMC, Parallel, eMMC, Serial, Single Wire, SPI, UFS, Xccela Bus, and 1-Wire.
| Select products | Mfr | Description | Package | Supplier Device Package | Mounting Type | Series | Operating Temperature |
|---|---|---|---|---|---|---|---|
| Renesas Electronics Corporation | IC SRAM 64KBIT PARALLEL 68PLCC | Tube | 68-PLCC (24.21x24.21) | Surface Mount | - | 0°C ~ 70°C (TA) | |
| Renesas Electronics Corporation | IC SRAM 64KBIT PARALLEL 68PLCC | Tape & Reel (TR) | 68-PLCC (24.21x24.21) | Surface Mount | - | 0°C ~ 70°C (TA) | |
| Renesas Electronics Corporation | IC SRAM 64KBIT PARALLEL 64TQFP | Tray | 64-TQFP (14x14) | Surface Mount | - | 0°C ~ 70°C (TA) | |
| Renesas Electronics Corporation | IC SRAM 64KBIT PARALLEL 64TQFP | Tape & Reel (TR) | 64-TQFP (14x14) | Surface Mount | - | 0°C ~ 70°C (TA) | |
| Renesas Electronics Corporation | IC SRAM 64KBIT PARALLEL 64TQFP | Tray | 64-TQFP (14x14) | Surface Mount | - | 0°C ~ 70°C (TA) | |
| Renesas Electronics Corporation | IC SRAM 64KBIT PARALLEL 64TQFP | Tape & Reel (TR) | 64-TQFP (14x14) | Surface Mount | - | 0°C ~ 70°C (TA) | |
| Renesas Electronics Corporation | IC SRAM 64KBIT PARALLEL 68PLCC | Tube | 68-PLCC (24.21x24.21) | Surface Mount | - | 0°C ~ 70°C (TA) | |
| Renesas Electronics Corporation | IC SRAM 64KBIT PARALLEL 68PLCC | Tape & Reel (TR) | 68-PLCC (24.21x24.21) | Surface Mount | - | 0°C ~ 70°C (TA) |

In an era dominated by AI accelerators with terabytes of HBM memory and consumer devices racing toward LPDDR5X bandwidth, it’s easy to wonder: why…
Read More
Munich, Germany – May 26, 2026 – Power semiconductor and automotive chip giant Infineon Technologies AG has formally notified customers worldwide of a second…
Read More
Recently, the global electronic components market has been constantly evolving, and different regions and enterprises have witnessed new moves in aspects such as technological…
Read More
The global memory market is entering an unprecedented supply-constrained phase as soaring demand from artificial intelligence (AI) infrastructure collides with strategic capacity reallocations by…
Read More
What Is NOR Flash? Why It Still Powers Critical Embedded Systems When your car’s engine control unit boots in milliseconds…When a medical device executes…
Read MoreThe Dutch government’s intervention in the control of Nexperia (Anshi Semiconductor) is triggering a chain reaction of turmoil in the global power semiconductor market.…
Read MoreRecently, global semiconductor manufacturers have been constantly making moves in aspects such as technological cooperation, product manufacturing processes, and market layout, demonstrating the rapid…
Read More
Tokyo / Munich / Tessenderlo, December 24, 2025As the global semiconductor industry enters the first year of the 2nm process era, international electronic component…
Read More
In the world of embedded electronics, getting a device to “think” is only half the battle. The other half is getting it to communicate…
Read MoreTOKYO, July 31, 2026 — Renesas Electronics Corporation has officially announced a major domestic manufacturing restructuring, confirming plans to gradually discontinue all wafer fabrication…
Read More
Learn what a battery BMS does, how protection differs from charging, and which pack specifications to check when sourcing BMS components through ChipApex.
Read More
Explore electronic component types, functions, packages and datasheets. Learn selection, replacement and BOM checks before ordering parts for your PCB.
Read More