BAT6207L4E6433XTMA1

RF Diode Overview

The BAT6207L4E6433XTMA1 is a Schottky barrier diode manufactured by Infineon Technologies. It features a maximum reverse voltage of 40V and a continuous forward current rating of 20mA. The component is housed in a TSLP-4 surface-mount package, designed for compact circuit layouts. This device complies with the Reach Compliance Code standards and carries an ECCN code of EAR99, indicating its classification under export control regulations.

RF Diode Feature Summary

• Schottky barrier technology for low forward voltage drop
• Compact TSLP-4 surface-mount packaging
• Rated for 40V reverse voltage and 20mA forward current

RF Diode Applications

• Signal detection circuits
• RF mixing applications
• Protection against reverse polarity

RF Diode Procurement Notes

Verify the specific ordering suffix E6433XTMA1 to ensure correct tape-and-reel packaging configuration. Confirm that the 40V/20mA ratings align with the target circuit requirements. Check for RoHS compliance status as indicated in official datasheets before finalizing procurement specifications.

RF Diode Selection Notes

Select this component when a small-footprint Schottky diode is required for low-current signal processing. The TSLP-4 package suits space-constrained designs. Ensure the operating temperature range meets system demands. Compare leakage current specifications against other available options if high-frequency performance is critical.

RF Diode Part Context

This part belongs to the BAT6207 series of dual Schottky diodes from Infineon. The L4 variant typically denotes a specific internal configuration or pinout arrangement within the family. The XTMA1 suffix identifies the standard reel packaging format used for automated assembly processes in manufacturing environments.

RF Diode Replacement Considerations

Check for direct equivalents such as BAT6207 variants from other manufacturers. Verify pin compatibility and electrical parameters like forward voltage and reverse leakage. Ensure the replacement maintains the same TSLP-4 footprint and thermal characteristics.