DSEC59-06BC

Diode Arrays Overview

The IXYS DSEC59-06BC is a HiPerFRED epitaxial diode featuring an ISOPLUS220 package with an electrically isolated back surface. It contains two independent diodes in a single component, offering a repetitive reverse voltage of 600 V and an average forward current of 30 A per diode at 105°C case temperature. The device exhibits a typical reverse recovery time of 30 ns and low cathode-to-tab capacitance below 15 pF. Electrical isolation between the mounting surface and leads reaches 2500 V RMS. Maximum ratings include a surge current of 200 A and a junction temperature range from -40°C to +175°C.

Diode Arrays Feature Summary

• Features an electrically isolated back surface on a direct-copper-bond substrate for high power dissipation and safety.
• Provides soft reverse recovery behavior to minimize electromagnetic interference and radio frequency noise.
• Utilizes planar passivated chips to ensure extremely low switching losses and low reverse recovery current values.

Diode Arrays Applications

• Antiparallel diode for high frequency switching devices
• Free wheeling diode in converters and motor control circuits
• Rectifiers in switch mode power supplies (SMPS)
• Snubber diode applications

Diode Arrays Procurement Notes

Verify the specific suffix against official documentation to confirm pin configuration. The DSEC variant utilizes a common cathode arrangement, whereas the DSEA variant uses a common anode setup. Ensure the selected part matches the required circuit topology before procurement. Confirm that the ISOPLUS220 package dimensions align with the intended heatsink or PCB layout constraints.

Diode Arrays Selection Notes

Select this component for high-frequency power conversion where electrical isolation is mandatory. The dual-diode configuration supports bridge or push-pull topologies within a single footprint. Consider the thermal resistance characteristics when designing the cooling system for continuous operation at elevated temperatures. The soft recovery profile makes it suitable for sensitive gate-drive environments requiring low EMI generation.

Diode Arrays Part Context

This component belongs to the HiPerFRED family of fast recovery epitaxial diodes manufactured by IXYS. These devices are engineered for high-efficiency power electronics, combining rapid switching capabilities with robust thermal management. The ISOPLUS220 packaging standard ensures compatibility with established industrial mounting techniques while providing enhanced isolation compared to traditional non-isolated packages.

Diode Arrays Replacement Considerations

Public confirmed substitute part numbers: DSEA59-06BC

Diode Arrays FAQ

What is the electrical isolation voltage of the DSEC59-06BC?

The device provides an isolation voltage of 2500 V RMS between the mounting surface and the electrical leads.

How does the DSEC59-06BC differ from the DSEA59-06BC?

The DSEC59-06BC features a common cathode configuration, while the DSEA59-06BC utilizes a common anode configuration.

What is the maximum operating junction temperature?

The maximum operating junction temperature is rated at 175°C.