FST8380M

Diode Arrays Overview

The GeneSiC FST8380M is a common cathode Schottky rectifier featuring two silicon elements in a single flange mount package. It provides an 80V DC blocking voltage and supports an average forward current of 40A per leg, totaling 80A per package. The device exhibits a maximum instantaneous forward voltage of 0.84V at 25°C and 40A. It withstands a peak forward surge current of 600A per leg. Thermal resistance from junction to case is 1.10°C/W per leg. Operating and storage temperatures range from -55°C to 150°C.

Diode Arrays Feature Summary

• Common cathode configuration with dual independent legs for efficient power conversion
• Low forward voltage drop characteristic to minimize conduction losses
• Robust thermal management via direct flange mount design
• High surge current capability for handling transient loads

Diode Arrays Applications

• DC-DC converters
• Power factor correction circuits
• Uninterruptible power supplies (UPS)
• Solar inverters

Diode Arrays Procurement Notes

Verify the specific part number against official GeneSiC Semiconductor documentation to confirm electrical ratings and pinout compatibility. Ensure the procurement channel provides authentic components with traceable manufacturing data. Cross-reference datasheet specifications for thermal resistance and voltage ratings prior to integration into final designs.

Diode Arrays Selection Notes

Select this component for applications requiring high efficiency and robust thermal performance in compact spaces. The common cathode arrangement simplifies circuit layout compared to discrete diodes. Evaluate the thermal resistance and mounting surface requirements to ensure adequate heat dissipation within the specified temperature limits.

Diode Arrays Part Context

This device belongs to the FST series of silicon Schottky rectifiers manufactured by GeneSiC Semiconductor. These components are designed for high-frequency switching applications where low reverse recovery charge and fast switching speeds are critical. The flange mount package facilitates direct attachment to heatsinks for improved thermal conductivity.

Diode Arrays Replacement Considerations

Consult official substitution guides for equivalent parts with matching voltage, current, and thermal specifications. Verify pinout compatibility and package dimensions before replacing existing components in established designs.