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MPXV2202GC6U is listed in the Pressure Sensors Transducers range at ChipApex. The manufacturer field lists NXP Semiconductors. Its product description is MPXV2202GC6U - Pressure Sensor,. Review the specifications below when checking this part for your BOM.
The MPXV2202GC6U is a silicon pressure sensor manufactured by NXP Semiconductors, designed for axial pressure measurement applications. It features an integrated on-chip temperature compensation and calibration system to ensure accuracy across varying thermal conditions. The device operates with a supply voltage of up to 10V and covers a pressure range of 0 to 200 kPa. It utilizes an SOP-8 plastic small outline package with 8 terminals, a 2.54 mm pitch, and physical dimensions of 10.67 mm x 10.67 mm x 12.96 mm.
Verify the specific suffix 'GC6U' against official NXP documentation to confirm package type and tape/reel specifications. Ensure compatibility with existing PCB footprints for SO-8 packages. Cross-reference datasheet revisions to confirm electrical characteristics match design requirements before finalizing procurement orders.
Select this component when axial pressure measurement within a 200 kPa range is required alongside integrated thermal compensation. Consider the SOP-8 package constraints for board space. Evaluate if the 10V maximum supply voltage aligns with system power rails. Confirm that the specific GC6U variant meets environmental operating conditions defined in the official specification sheet.
This part belongs to the MPXV series of silicon pressure sensors from NXP Semiconductors. The series is characterized by on-chip signal conditioning and temperature compensation. The MPXV2202GC6U specifically denotes the 200 kPa range variant in an SOP-8 package, distinguishing it from other ranges or package options within the broader product family.
MPXV2202GC6TI is a documented similar part number within the same manufacturer ecosystem. Verify pinout compatibility and exact electrical parameter alignment before substitution. Check for any differences in packaging or suffix designations that may affect mechanical integration.
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