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— IC芯片 | 连接器 | 传感器 | 被动器件 —
Sensor and Detector Interfaces
Products in this family perform signal conditioning, data conversion, stimulus generation, and/or a variety of other functions needed to connect a sensor or transducer mechanism to a host device. Examples include controllers for CCD image sensors, current transmitters for 4-20 mA interface and similar applications, ultrasound transducer front-ends, wheatstone bridge interfaces, and others.
Screen Default Ranking Price By Date
| Select products | Mfr | Description | Package | Supplier Device Package | Mounting Type | Series | Operating Temperature |
|---|---|---|---|---|---|---|---|
 ZSC31150GED $7.34 | Renesas Electronics Corporation | DICE (WAFER SAWN) - WAFFLE PACK | Tray | - | - | * | - |
| Renesas Electronics Corporation | WAFER (UNSAWN) - BOX | Tray | - | - | * | - | |
| Renesas Electronics Corporation | DICE (WAFER SAWN) - FRAME | Tray | - | - | * | - | |
| Renesas Electronics Corporation | WAFER (UNSAWN) - BOX | Tray | - | - | * | - | |
| Renesas Electronics Corporation | WAFER (UNSAWN) - BOX | Tray | - | - | * | - | |
ZSSC3018BA1B $1.66 | Renesas Electronics Corporation | WAFER (UNSAWN) - BOX | Tray | Die | Surface Mount | - | -40°C ~ 125°C (TA) |
ZSSC3018BA1C $1.62 | Renesas Electronics Corporation | DICE (WAFER SAWN) - FRAME | Tray | Die | Surface Mount | - | -40°C ~ 125°C (TA) |
| Renesas | DICE IN WAFFLE PACK | Bulk | - | - | - | - |
