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— IC芯片 | 连接器 | 传感器 | 被动器件 —
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— IC芯片 | 连接器 | 传感器 | 被动器件 —

Devices in the System-on-Chip family combine on one device substrate several computing system components which traditionally would be implemented as separate devices, such as a general-purpose microprocessor, an FPGA co-processor, and a graphics controller for generation of display data. While limited amounts of data storage resources may also be incorporated, the provision of an interface to external storage devices is typical.
| Select products | Mfr | Description | Package | Supplier Device Package | Mounting Type | Series | Operating Temperature |
|---|---|---|---|---|---|---|---|
| Qualcomm | QCC-744-2-MQFN56-TR-00-0. | Tape & Reel (TR) | 56-QFN (7x7) | Qualcomm® QCC740 | -40°C ~ 105°C | ||
| Qualcomm | 4X1.4 GHZ A53,1080P30 GPU/DISPLA | Tray | - | Qualcomm® QCC400 | - | ||
| Qualcomm | 4X1.4 GHZ A53,1080P30 GPU/DISPLA | Tape & Reel (TR) | - | Qualcomm® QCC400 | - | ||
| Renesas Electronics Corporation | IC SOC SH-4A 400MHZ 449BGA | Tray | 449-BGA (21x21) | - | - | ||
| Renesas Electronics Corporation | IC MCU | Bulk | 449-FBGA (21x21) | - | - | ||
| Renesas Electronics Corporation | IC SOC SH-4A 400MHZ 449BGA | Tray | 449-BGA (21x21) | - | - | ||
| Renesas Electronics Corporation | IC SOC | Tray | - | * | - | ||
![]() R8A77970LA01BA#GB $34.43 | Renesas Electronics Corporation | SOC R-CAR V3M | Tray | - | - | - |

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